Abstract
Classically, packaging consists of assembly, interconnection and passivation. The technological advances in miniaturization, however, have changed all three aspects and have moved the focus onto system integration. Instead of developing hardware, software and technology separately, the whole system has to be considered and optimized for a further size reduction. The following chapter discusses the design and realization of tiny, highly integrated devices. It will show interdependenc es between the miniaturization techniques as well as the design of hardware and software. Initially several system aspects will be mentioned. Thereafter the integration technologies will be reflected in more detail.
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© 2005 Springer-Verlag Berlin Heidelberg
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Kallmayer, C., Niedermayer, M., Guttowski, S., Reichl, H. (2005). Packaging Challenges in Miniaturization. In: Weber, W., Rabaey, J.M., Aarts, E. (eds) Ambient Intelligence. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-27139-2_15
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DOI: https://doi.org/10.1007/3-540-27139-2_15
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-23867-6
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