Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
R. E. Beaty, R. C. Jaeger, J. C. Suhling, R. W. Johnson, R. D. Butler, “Evaluation of Piezoresistive Coefficient Variation in Silicon Stress Sensors Using a Four-point Bending Test Fixture,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15, No. 5, pp. 904–914, 1992.
S. F. Chu, “Piezoresistive Properties of Boron and Phosphorous Implanted Layers in Silicon,” Ph.D. Thesis, Case Western Reserve University, 1978.
G. G. Harman, “Wire Bonding in Microelectronics: Materials, Processes, Reliability, & Yield,” McGraw-Hill, 2nd Ed., New York, 1997.
M. Mayer, J. Schwizer, “Wire Bonder Ultrasonic System Calibration Using Integrated Stress Sensor”, Proc. SEMI Technical Symposium, Advanced Packaging Technologies II, SEMI Singapore, pp. 169–175, 2002.
SPT, Small Precision Tools, http://www.sptca.com/frames-products.htm
NIST Property Data Summaries, Elastic Moduli Data for Polycrystalline Ceramics, http://www.ceramics.nist.gov/srd/summary/EmodOxRf.htm
J. B. Wachtman, and D. G. Lam, “Young’s Modulus of Various Refractory Materials as a Function of Temperature,” Journal of the American Ceramic Society, 42, No. 5, pp. 254–260, 1959.
D. S. Gardner, P. A. Flinn, “Mechanical Stress as a Function of Temperature in Aluminum Films,” IEEE Transactions on Electron Devices, 35, No. 12, 1988.
E. Suhir, “Stresses in Bi-Metal Thermostats,” Journal of Applied Mechanics, 53, pp. 657–660, 1986.
Rights and permissions
Copyright information
© 2005 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
(2005). Characterization. In: Force Sensors for Microelectronic Packaging Applications. Microtechnology and MEMS. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-26945-2_4
Download citation
DOI: https://doi.org/10.1007/3-540-26945-2_4
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-22187-6
Online ISBN: 978-3-540-26945-8
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)