Abstract
Many processes are composed of Bays with equipments. Most 300mm wafer lines use AMHS (Automated Material Handling System) for inter-bay and intra-bay lot transportation. In particular, the inter-bay AMHS moves lots between stockers, whereas intra-bay AMHS moves lots between stockers and tools, or between tools within the same bay. Most companies are trying to reduce average cycle time to increase productivity and delivery time. In this paper, we proposed simulation process standardization method in 300mm FAB semiconductor manufacturing process to propose simulation model verification method. Also we tried to prove efficiency of adopting the simulation theory in real production line.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Choi, B.K., Kim, B.H.: MES (manufacturing execution system) architecture for FMS compatible to ERP(enterprise planning system). INT. J. Computer Integrated Manufacturing 15(3), 274–284 (2002)
SEMI E53-1296 Event Reporting, SEMI Standard (2000)
Wein, L.M.: On the relationship Between Yield and Cycle time Semiconductor Wafer
Izak, D., John, W.F., Schruben, L.W.: Planning and Scheduling in Japanese Semiconductor Manufacturing. Journal of Manufacturing Systems 13(5), 323–332 (1993)
Han, Y., Park, D., Chae, S., Lee, C.: Full fabrication simulation of 300mm wafer focused on AMHS (Automated material handling systems). In: Baik, D.-K. (ed.) AsiaSim 2004. LNCS (LNAI), vol. 3398, pp. 514–520. Springer, Heidelberg (2005)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2006 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Park, D., Han, Y., Lee, C. (2006). Optimization of a Simulation for 300mm FAB Semiconductor Manufacturing. In: Gavrilova, M.L., et al. Computational Science and Its Applications - ICCSA 2006. ICCSA 2006. Lecture Notes in Computer Science, vol 3984. Springer, Berlin, Heidelberg. https://doi.org/10.1007/11751649_28
Download citation
DOI: https://doi.org/10.1007/11751649_28
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-34079-9
Online ISBN: 978-3-540-34080-5
eBook Packages: Computer ScienceComputer Science (R0)