Ultraprecision Finishing of Photomask Substrate by Utilizing Atmospheric Pressure Plasma
- 1.8k Downloads
In the case of the atmospheric pressure plasma, localized high density plasma is generated around the electrode. Therefore, free figuring without mask pattern is realized by scanning the localized reactive etching area. And we developed new ultra precision machining method which is named plasma chemical vaporization machining (PCVM) utilizing atmospheric pressure plasma. In this paper, we report the performance of the PCVM in the finishing process of photomask substrate made of quartz glass. And as a result of the correcting process of the flatness of the 6 inches square substrate, the flatness of 100 nm or less without degradation of the surface roughness was achieved.
Keywordsatmospheric pressure plasma PCVM photomask quartz glass flatness
Unable to display preview. Download preview PDF.
- Paul E. Murphy, James T. Mooney, Thomas P. Courtney, (2003) Fabrication of EUV components with MRF, Proc. of SPIE 5193:29–38Google Scholar
- K. Yamamura, K. Yamauchi, H. Mimura, Y. Sano, A. Saito, K. Endo, A. Souvorov, M. Yabashi, K. Tamasaku, T. Ishikawa, and Y. Mori, (2003) Fabrication of elliptical mirror at nanometer-level accuracy for hard x-ray focusing by numerically controlled plasma chemical vaporization machining, Rev. Sci. Instrum. 74:4549–4553CrossRefGoogle Scholar
- M. Shibahara, K. Yamamura, Y. Sano, T. Sugiyama, K. Endo and Y. Mori, (2005) Improvement of thickness uniformity of quartz crystal wafer by numerically controlled plasma CVM, Proc. SPIE 5869:58690IGoogle Scholar