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Ultraprecision Finishing of Photomask Substrate by Utilizing Atmospheric Pressure Plasma

  • Kazuya Yamamura
  • Akihiro Fujiwara
  • Koji Ueno
  • Yasuhisa Sano
  • Masafumi Shibahara
  • Katsuyoshi Endo
  • Yuzo Mori
Conference paper
  • 1.8k Downloads

Abstract

In the case of the atmospheric pressure plasma, localized high density plasma is generated around the electrode. Therefore, free figuring without mask pattern is realized by scanning the localized reactive etching area. And we developed new ultra precision machining method which is named plasma chemical vaporization machining (PCVM) utilizing atmospheric pressure plasma. In this paper, we report the performance of the PCVM in the finishing process of photomask substrate made of quartz glass. And as a result of the correcting process of the flatness of the 6 inches square substrate, the flatness of 100 nm or less without degradation of the surface roughness was achieved.

Keywords

atmospheric pressure plasma PCVM photomask quartz glass flatness 

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6 References

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Copyright information

© Springer-Verlag London Limited 2007

Authors and Affiliations

  • Kazuya Yamamura
    • 1
  • Akihiro Fujiwara
    • 1
  • Koji Ueno
    • 1
  • Yasuhisa Sano
    • 1
  • Masafumi Shibahara
    • 2
  • Katsuyoshi Endo
    • 1
  • Yuzo Mori
    • 1
  1. 1.Osaka UniversityOsaka
  2. 2.Hyogo Prefectural Institute of TechnologyJapan

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