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Oppermann, H. (2005). The Role of Au/Sn Solder in Packaging. In: Zschech, E., Whelan, C., Mikolajick, T. (eds) Materials for Information Technology. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/1-84628-235-7_31
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DOI: https://doi.org/10.1007/1-84628-235-7_31
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