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References

  1. For a more detailed review of microfabrication see for example: Fundamentals of Microfabrication: The Science of Miniaturization, Second Edition, Marc J. Madou, CRC Press, ISBN: 0849308267, 2002.

    Google Scholar 

  2. For a more detailed review on deposition methods see for example: Physics and Technology of Semiconductor Devices, Andrew S. Grove, John Wiley and Sons, ISBN: 0471329983, 1967.

    Google Scholar 

  3. H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgartel, Journal of the Electrochemical Society 137 3612 (1990).

    CAS  Google Scholar 

  4. O. Tabata, R. Asahi, H. Funabashi, K. Shimaoka, S. Sugiyama, Sensors and Actuators A, 34(1) 51–57, July 1992.

    Article  Google Scholar 

  5. R. Howe, J. Vac. Sci. Technol. B, 6(6), 1809–1813, Nov 1988.

    Article  Google Scholar 

  6. H. Guckel, J. J. Sniegowski, T. R. Christenson, S. Mohney, and T. F. Kelly, “Fabrication of Micromechanical Devices from Polysilicon Films with Smooth Surfaces,” Sensors Actuators, 20(1–2), 117–122, Nov 1989.

    CAS  Google Scholar 

  7. G. E. Moore, “Cramming More Components onto Integrated Circuits,” Electronics 38, 114–117, April 19, 1965.

    Google Scholar 

  8. G. E. Moore, “Progress in Digital Integrated Electronics,” Digest of the 1975 International Electron Devices Meeting, IEEE, New York, 1975, pp. 11–13.

    Google Scholar 

  9. G. Moore, “No Exponential is Forever ... But Forever can be Delayed,” ISSCC 2003, February 9–13 2003, San Francisco, CA.

    Google Scholar 

  10. International Roadmap for Semiconductors 2001 Edition, Semiconductor Industry Association, http://public.itrs.net/

  11. J. Smith, S. Montague, J. Sniegowski, J. Murray, and P. McWhorter, “Embedded micromechanical devices for the monolithic integration of MEMS with COS,” Proc. IEDM’ 95, pp. 609–612, 1995.

    Google Scholar 

  12. J. C. Marshall, M. Parsmeswaran, M. E, Zaghloul, and M. Gaitan, “High-Level CAD Melds Micromachined Devices with Foundries,” IEEE Circuits and Devices, 8(6), 10–17, November 1992.

    Google Scholar 

  13. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. Lu, L. Carley, “Laminated high-aspect-ratio microstructures in a conventional CMOS process,” Sensors and Actuators A, 57(2): 103–110 Nov 1996.

    Google Scholar 

  14. M. Parameswaran, H. P. Baltes, L. Ristic, A. C. Dhadad, and A. M. Robinson, “A New Approach for the Fabrication of Micromechanical Structures,” Sensors and Actuators, 19, 289–307, 1989.

    Article  CAS  Google Scholar 

  15. C. Mead and L. Conway, “The Caltech Intermediate Form for LSI Layout Description,” In Introduction to VLSI Systems, pages 115–127. Addison-Wesley, 1980.

    Google Scholar 

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Gaitan, M. (2004). Introduction to Integrative Systems. In: Di Ventra, M., Evoy, S., Heflin, J.R. (eds) Introduction to Nanoscale Science and Technology. Nanostructure Science and Technology. Springer, Boston, MA. https://doi.org/10.1007/1-4020-7757-2_16

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  • DOI: https://doi.org/10.1007/1-4020-7757-2_16

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4020-7720-3

  • Online ISBN: 978-1-4020-7757-9

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