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Deep, Three-Dimensional Silicon Micromachining

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Bonding in Microsystem Technology

Part of the book series: Springer Series in Advanced Microelectronics ((MICROELECTR.,volume 24))

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(2006). Deep, Three-Dimensional Silicon Micromachining. In: Bonding in Microsystem Technology. Springer Series in Advanced Microelectronics, vol 24. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4589-1_3

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