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Investigation on Thermal Distress and Scuffing Failure Under Micro EHL Conditions

  • Conference paper
IUTAM Symposium on Elastohydrodynamics and Micro-elastohydrodynamics

Part of the book series: Solid Mechanics and Its Applications ((SMIA,volume 134))

Abstract

Scuffing is a degenerative form of adhesive wear caused by local welding between mating surfaces. Classical methods for scuffing prediction indicate the surface temperature rise (flash temperature) due to friction generated heat as the most important index to assess the risk of scuffing. Nowadays numerical analyses constitute a useful tool to provide a good knowledge in mixed lubrication. However, the difficulties of taking into account the many parameters involved in wear, such as mechanical and chemical changes, do not allow us to use them to simulate a wear process or as a practical design tool. Moreover the model used to represent the surface roughness is of great importance since scuffing is associated with asperity interactions. Some roughness models are discussed. Aramaki and co-worker’s roughness model has been chosen and implemented in a numerical code for the assessment of contact temperature and pressure in lubricated rough contacts. The new simplified approach proposed seems to be promising as a tool for a practical and easy to apply scuffing criterion.

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Polacco, A., Pugliese, G., Ciulli, E., Bragallini, G.M., Facchini, M. (2006). Investigation on Thermal Distress and Scuffing Failure Under Micro EHL Conditions. In: Snidle, R.W., Evans, H.P. (eds) IUTAM Symposium on Elastohydrodynamics and Micro-elastohydrodynamics. Solid Mechanics and Its Applications, vol 134. Springer, Dordrecht . https://doi.org/10.1007/1-4020-4533-6_23

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  • DOI: https://doi.org/10.1007/1-4020-4533-6_23

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-4532-5

  • Online ISBN: 978-1-4020-4533-2

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