Abstract
In this study, a defect-free, self-assembled monolayer of octadecyltrichlorosilane (OTS) was deposited on a silicon substrate. Nanoindentation experiments were performed with an interfacial force microscope (IFM) on these 2.5 nm monolayers. As a first step in continuum finite element analyses, the OTS was assumed to be linearly elastic and isotropic. Adhesive interactions were also accounted for via a cohesive zone model. However, the assumption of linearity gave rise to force profiles that did not match the measurements. Molecular dynamics simulations were therefore employed in order to provide further insight into the behavior of OTS. These simulations indicated that the OTS had a highly non-linear and nearly incompressible response. Based on these results, a hypo-elastic material model was developed as a convenient continuum representation of the mechanical behavior of OTS. This was then used in finite element analyses, which were able to fully reproduce the IFM force profiles. As a result, molecular and microscopic scales were linked in a relatively simple but very effective manner. This suggests that there is a class of problems where the continuum representation of the material behavior may be directly obtained from molecular analyses.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
R. Maboudian, W.R. Ashurst, and C. Carraro, Tribological challenges in micromechanical systems, Tribology letters, 12, pp.95–100, 2002.
B. Bhushan, Principles and Applications of Tribology, p.739, John Wiley and Sons Inc., New York, 1999.
T.M. Mayer, J.W. Elam, S.M. George, P.G. Kotula, and R.S. Goeke, Atomiclayer deposition of wear-resistant coatings for microelectromechanical devices, Applied Physics Letters, 82, pp.2883–2885, 2003.
A.D. Jr. Romrig, M.T. Dugger, P.J. McWhorter, Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability, Acta Materialia, 51, pp.5837–5866, 2003.
J.E. Houston and T. Kim, Separating mechanical and chemical contributions to molecular-level friction, J. Am. Chem. Soc., 122, pp.12045–12046 2000.
R.W. Carpick, N. Agraït, D.F. Ogletree, and M. Salmeron, Variation of the interfacial shear strength and adhesion of a nanometer-sized contact, Langmuir, 12, pp.3334–3340, 1996.
A.V. Zhuk, A.G. Evans, J.W. Hutchinson, and G.M. Whitesides, The adhesion energy between polymer thin films and self-assembled monolayers, Journal of Materials Research 13, pp.3555–3564, 1998.
M.S. Kent, E.D. Reedy, H. Yim, A. Matheson, J. Sorenson, J. Hall, K. Schubert, D. Tallant, M. Garcia, T. Ohlhausen, and R. Assink, Using self-assembling monolayers to study crack initiation in epoxy/silicon joints, Journal of Materials Research, 19, pp.1682–1695, 2004.
A.W. Mello, and K.M. Liechti, Controlling mixed-mode interfacial fracture toughness with self-assembled monolayers, to appear J. Appl. Mech., 2004.
M. Wang, K.M. Liechti, Q. Wang, and J.M. White, Self-assembled silane monolayers: fabrication with nanoscale uniformity, to appear Langmuir, 2004.
J.E. Houston and T.A. Michalske, The interfacial-force microscope, Nature 356, pp.266–267, 1992.
M. Wang, K.M. Liechti, J.M. White, and R.M. Winter, Nanoindentation of polymeric thin films with an interfacial force microscope, J. Mech. Phys. Solids, 52(10), pp.2329–2354, 2004.
M. Wang, K.M. Liechti, V. Srinivasan, J.M. White, P.J. Rossky, T.M. Stone, A hybrid molecular-continuum analysis of IFM experiments of a self-assembled monolayer, to appear J. Appl. Mech., 2004.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2005 Springer
About this paper
Cite this paper
Wang, M., Liechti, K.M., Srinivasan, V., White, J.M., Rossky, P.J. (2005). Nano Mechanical Analysis of IFM Force Profiles on Self-Assembled Monolayers. In: Gutkowski, W., Kowalewski, T.A. (eds) Mechanics of the 21st Century. Springer, Dordrecht. https://doi.org/10.1007/1-4020-3559-4_14
Download citation
DOI: https://doi.org/10.1007/1-4020-3559-4_14
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-3456-5
Online ISBN: 978-1-4020-3559-3
eBook Packages: EngineeringEngineering (R0)