Abstract
In microelectronics, photonics, opto-electronics, high frequency or high power device applications, the needs for specific substrate solutions are more and more required. Smart Cut™ technology appears as the technological answer that enables the industrial to provide engineered substrate solutions tailored to the applications. For instance a large spectrum of SOI type structures are today in volume manufacturing. At present the industrial is focused on composite substrates. This paper focuses on the realization of advanced SOI, strained SOI, SOQ substrates and many other examples of engineered substrates. Highlights are given on the most recent developments.
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Moriceau, H. et al. (2005). Smart Cut Technology: The Path for Advanced SOI Substrates. In: Flandre, D., Nazarov, A.N., Hemment, P.L. (eds) Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment. NATO Science Series II: Mathematics, Physics and Chemistry, vol 185. Springer, Dordrecht. https://doi.org/10.1007/1-4020-3013-4_4
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DOI: https://doi.org/10.1007/1-4020-3013-4_4
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-3011-6
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