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SOI Technology as a Basis for Microphotonic-Microelectronic Integrated Devices

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Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment

Part of the book series: NATO Science Series II: Mathematics, Physics and Chemistry ((NAII,volume 185))

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Abstract

A survey of crucial issues relating to the origin of Silicon On Insulator based microphotonics is presented. The main problem in microphotonics is the large size of today's photonic circuits in comparison with ULSI electronic ones. To increase the level of integration in photonic components, compact building blocks are required, performing elementary optical functions. Photonic crystals or, generally, photonic band gap materials offer a way to this reduction in size. Special attention is given to optical properties of two dimensional photonic crystal slabs which are well adapted to the domain of integrated optics.

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Author information

Authors and Affiliations

  1. Institute of Microelectronics Technology and high-purity Materials, Russian Academy of Science, 142432, Chernogolovka, Moscow Region, Russia

    M.Yu. Barabanenkov, V.V. Aristov & V.N. Mordkovich

Authors
  1. M.Yu. Barabanenkov
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  2. V.V. Aristov
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  3. V.N. Mordkovich
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Editor information

Editors and Affiliations

  1. Microelectronics Laboratory, Université Catholique de Louvain, Louvain-la-Neuve, Belgium

    Denis Flandre

  2. Institute of Semiconductor Physics, National Academy of Science of Ukraine, Kyiv, Ukraine

    Alexei N. Nazarov

  3. School of Electronics and Physical Sciences, University of Surrey, Guildford, UK

    Peter L.F. Hemment

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© 2005 Kluwer Academic Publishers

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Barabanenkov, M., Aristov, V., Mordkovich, V. (2005). SOI Technology as a Basis for Microphotonic-Microelectronic Integrated Devices. In: Flandre, D., Nazarov, A.N., Hemment, P.L. (eds) Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment. NATO Science Series II: Mathematics, Physics and Chemistry, vol 185. Springer, Dordrecht. https://doi.org/10.1007/1-4020-3013-4_3

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  • DOI: https://doi.org/10.1007/1-4020-3013-4_3

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-3011-6

  • Online ISBN: 978-1-4020-3013-0

  • eBook Packages: EngineeringEngineering (R0)

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