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Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332-0245, USA

    Grace Y. Li & C. P. Wong

Authors
  1. Grace Y. Li
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  2. C. P. Wong
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Editor information

Editors and Affiliations

  1. University of California, Santa Cruz, California, USA

    E. Suhir

  2. University of Maryland, College Park, Maryland, USA

    E. Suhir

  3. University of Colorado, Boulder, Colorado, USA

    Y. C. Lee

  4. Georgia Tech, Atlanta, Georgia, USA

    C. P. Wong

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Li, G.Y., Wong, C.P. (2007). Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_42

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  • DOI: https://doi.org/10.1007/0-387-32989-7_42

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-27974-9

  • Online ISBN: 978-0-387-32989-5

  • eBook Packages: EngineeringEngineering (R0)

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