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Reconfigurable Hardware Exploitation in Wireless Multimedia Communications

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System Level Design of Reconfigurable Systems-on-Chip

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Abstract

This chapter presents cases where reconfigurable hardware can be exploited for the efficient realization of wireless multimedia communication systems. The various scenarios described are referring to (a) the DLC/MAC layer and the baseband part of the physical layer of HIPERLAN/2 and IEEE 802.11a WLAN protocols, and (b) the application layer of a sophisticated personal device. The goal of this chapter is to provide an insight on the advantages reconfigurable hardware may bring in real life applications.

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References

  1. ETSI (2000), Broadband Radio Access Networks (BRAN); HIPERLAN type 2; Physical (PHY) layer, v1.2.1

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  2. Van Nee R, Prasad R (1999) OFDM for Mobile Multimedia Communications. Boston: Artech House

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  3. IEEE Std 802.11a/D7.0 (1999) Part 1: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications: High Speed Physical Layer in the 5 GHz Band

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  5. Lafruit G, Nachtergaele L, Denolf K, Bormans J (2000) 3D Computational Graceful Degradation. In: Proceedings of ISCAS — Workshop and Exhibition on MPEG-4, vol. 3, pp. 547–550

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Author information

Author notes

  1. Konstantinos Masselos

    Present address: Imperial College of Science Technology and Medicine, UK

Authors and Affiliations

  1. INTRACOM S.A., Hellenic Telecommunications and Electronics Industry, Greece

    Konstantinos Masselos & Nikolaos S. Voros

Authors
  1. Konstantinos Masselos
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  2. Nikolaos S. Voros
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Editor information

Editors and Affiliations

  1. INTRACOM S.A., Patra, Greece

    Nikolaos S. Voros

  2. Imperial College of Science Technology and Medicine, London, UK

    Konstantinos Masselos

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© 2005 Springer

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Cite this chapter

Masselos, K., Voros, N.S. (2005). Reconfigurable Hardware Exploitation in Wireless Multimedia Communications. In: Voros, N.S., Masselos, K. (eds) System Level Design of Reconfigurable Systems-on-Chip. Springer, Boston, MA. https://doi.org/10.1007/0-387-26104-4_2

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  • DOI: https://doi.org/10.1007/0-387-26104-4_2

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-26103-4

  • Online ISBN: 978-0-387-26104-1

  • eBook Packages: EngineeringEngineering (R0)

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