4. Conclusions
In many applications of ceramic and glass materials, appropriate thermal conductivity is intrinsically linked to their applications. Through selected examples, we have illustrated how recent advances in thermal conductivity allow us to better understand thermal conductivities of ceramics and glasses, thereby advancing uses of these important materials.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
5. References
G. A. SlackNonmetallic Crystals with High Thermal Conductivity J. Phys. Chem. Solids 34, 321–335 (1973).
P. GreilAdvanced Engineering Ceramics Adv. Eng. Mater. 4, 247–254 (2002).
D. R. Fear and S. ThomasEmerging Materials Challenges in Microelectronics Packaging MRS Bulletin 28(1), 68–74 (2003).
V. P. Atluri, R. V. Mahajan, P. R. Patel, D. Mallik, J. Tang, V. S. Wakharkar, G. M. Chrysler, C.-P. Chiu, G. N. Choksi, and R. S. ViswanathCritical Aspects of High-Performance Microprocessor Packaging MRS Bull. 28(1), 21–34 (2003).
W. Werdecker and F. AldingerAluminum Nitride — An Alternative Ceramic Substrate for High Power Applications in Microcircuits IEEE Trans. Comp., Hybrids, Manuf. Technol. 7, 399–404 (1984).
Y. Kurokawa, K Utsumi, H. Takamizawa, T. Kamata, and S. NoguchiAlN Subtrates with High Thermal Conductivity IEEE Trans. Comp., Hybrids, Manuf. Technol. 8, 247–252 (1985).
D. G. Brunner and K. H. WienandMetallized Aluminium Nitride Ceramics — Potential, Properties, Applications Interceram. 37(4), 29–32 (1988).
N. IchinoseAluminium Nitride Ceramics for Substrates Mater. Sci. Forum 34–36, 663–667 (1988).
F. Miyashiro, N. Iwase, A. Tsuge, F. Ueno, M. Nakahashi, and T. TakahashiHigh Thermal Conductivity Aluminium Nitride Ceramic Substrates and Packages IEEE Trans. Comp., Hybrids, Manuf. Technol. 13, 313–319 (1990).
R. R. TummalaCeramic and Glass-Ceramic Packaging in the 1990s J. Am. Ceram. Soc. 74(5), 895–908 (1991).
A. V. VirkarThermodynamic and Kinetic Effeccts of Oxygen Removal on the Thermal Conductivity of Aluminum Nitride J. Am. Ceram. Soc. 72(11), 2031–2042 (1989).
L. M. SheppardAluminum Nitride: A Versatile but Challenging Material Am. Ceram. Soc. Bull. 69(11), 1801–1812 (1990).
G. W. Prohaska and G. R. MillerAluminum Nitride: A Review of the Knowledge Base for Physical Property Development Mat. Res. Soc. Symp. Proc. 167, 215–227 (1990).
G. A. Slack and S. F. BartramThermal Expansion of Some Diamondlike Crystals J. Appl. Phys. 1, 89–98 (1975).
K. Watari, T. Tsugoshi, T. Nagaoka, K. Ishizaki, S. Ca, and K. Mori in Proceedings of the 18th International Japan-Korea Seminar on Ceramics Edited by A. Kato, H. Tateyama and H. Hasuyama (TIC, Japan 2001), 98–101.
K. Watari, M. Kawamoto, and K. IshizakiSintering Chemical Reactions to Increase Thermal Conductivity of Aluminum Nitride J. Mater. Sc. 26(17), 4727–4732 (1991).
K. Watari, H. Nakano, K. Urabe, K. Ishizaki, S. Cao, and K. MoriThermal Conductivity of AlN Ceramic with a Very Low Amount of Grain Boundary Phase at 4 to 1000 K J. Mater. Res. 17(11), 2940–2944 (2002).
T. B. Jackson, A. V. Virkar, K. L. More, R. B. Dinwiddie, Jr., and R. A. CutlerHigh-Thermal-Conductivity Aluminum Nitride Ceramics: the Effect of Thermodynamic, Kinetic, and Microstructural Factors J. Amr. Ceram. Soc.80(6), 1421–1435 (1997).
X. Xu, H. Zhuang, W. Li, S. Xu, B. Zhang, and X. FuImproving Thermal Conductivity of Sm2O3-doped AlN Ceramics by Changing Sintering Conditions Mat. Sci. Eng. A 342, 104–108 (2003).
J. Jarrige, J. P. Lecompte, J. Mullot, and G. MillerEffecct of Oxygen on the Thermal Conductivity of Aluminium Nitride Ceramics J. Europ. Ceram. Soc. 17, 1891–1895 (1997).
K. Watari, M. E. Brito, T. Nagaoka, M. Toriyama, and S. KanzakiAdditives for Low-Temperature Sintering of AlN Ceramics with High Thermal Conductivity and High Strength Key Engin. Mater. 159–160, 205–208 (1999).
Y. Liu, H. Zhou, Y. Wu, and L. QiaoImproving Thermal Conductivity of Aluminum Nitride Ceramics by Refining Microstructure Mater. Lett. 43(3), 114–117 (2000).
G. Pezzotti, A. Nakahira, and M. TajikaEffect of Extended Annealing Cycles on the Thermal Conductivity of AlN/Y2O3Ceramics J. Europ. Ceram. Soc. 20(9), 1319–1325 (2000).
L. Qiao, H. Zhou, H. Xue, and S. WangEffect of Y2O3on Low Temperature Sintering and Thermal Conductivity of AlN Ceramics J. Europ. Ceram. Soc. 23, 61–67 (2003).
J. S. Haggerty and A. LightfootOpportunities for Enhancing the Thermal Conductivities of SiC and Si3N4Ceramics Through Improved Processing Ceram. Eng. Sci. Proc. 16(4), 475–487 (1995).
M. Mitayama, K. Hirao, M. Toriyama, and S. KanzakiThermal Conductivity of β-Si3N4: I, Effects of Various Microstructural Factors J. Am. Ceram. Soc. 82(11), 3105–3112 (1999).
G. Ziegler and D. P. H. HasselmanEffect of Phase Composition and Microstructure on the Thermal Diffusivity of Silicon Nitride J. Mater. Sci. 16, 495–503 (1981).
M. Kuriyama, Y. Inomata, T. Kijima, and Y. HasegawaThermal Conductivity of Hot-Pressed Si3N4by Laser-Flash Method, Amer. Ceram. Soc. Bull. 57(12), 1119–1122 (1978).
K. Tsukuma, M. Shimada and M. KoizumiThermal Conductivity and Microhardness of Si3N4with and without Additives Am. Ceram. Soc. Bull. 60(9), 910–912 (1981).
K. Watari, K. Hirao and M. ToriyamaEffect of Grain Size on the Thermal Conductivity of Si3N4 J. Am. Ceram. Soc. 82(3), 777–779 (1999).
Y. Okamoto, N. Hirosaki, M. Ando, F. Munakata, and Y. AkimuneThermal Conductivity of Self-reinforced Silicon Nitride Containing Large Grains Aligned by Extrusion Pressing J. Ceram. Soc. Jpn. 105, 631–633 (1997).
S. W. Lee, H. B. Chae, D. S. Park, Y. H. Choa, K. Niihara, and B. J. HockeyThermal Conductivity of Unidirectionally Oriented Si3N4w/Si3N4Composites J. Mater. Sci. 35, 4487–4493 (2000).
N. Hirosaki, Y. Okamoto, F. Munakata, and Y. AkimuneEffect of Seeding on the Thermal Conductivity of Self-reinforced Silicon Nitride J. Europ. Ceram. Soc. 19, 2183–2187 (1999).
Y. Lin, X.-S. Ning, H. Zhou, and W. XuStudy on the Thermal Conductivity of Silicon Nitride Ceramics with Magnesia and Yttria as Sintering Additives Mat. Lett. 57, 15–19 (2002).
N. Hirosaki, Y. Okamoto, M. Ando, F. Munakata and Y. AkimuneEffect of Grain Growth on the Thermal Conductivity of Silicon Nitride J. Ceram. Soc. Jpn. 104, 49–53 (1996).
H. Hubner and E. DorreAlumina: Processing, Properties and Applications (Springer-Verlag, Berlin, 1984), pp. 220–265.
W. Nunes Dos Santos, P. I. P. Filho, and R. TaylorEffect of Addition of Niobium Oxide on the Thermal Conductivity of Alumina, J. Europ. Ceram. Soc. 18, 807–811 (1998).
R. S. Roth, T. Nagas, and L. P. CookPhase Diagrams for Ceramics, The American Ceramic Society, Columbus, OH (1981), 4, 117.
Y. Liao, R.C. Fang, Z. Y. Ye, N.G. Shang, S. J. Han, Q. Y. Shao, and S.Z. JiInvestigation of the Thermal Conductivity of Diamond Film on Aluminum Nitride Ceramic App. Phys. A 69, 101–103 (1999).
I. J. Davies, T. Ishikawa, N. Suzuki, M. Shibuya, and T. HirokawaProc. 5thJapan Int. SAMPE Symp. (Japan Chapter of SAMPE, Yokohama (1997), pp. 1672–1632.
M. Takeda, Y. Imai, H. Ichikawa, Y. Kagawa, H. Iba, and H. KakisawaSome Mechanical Properties of SiC (Hi-Nicalon) Fiber-Reinforced SiC Matrix Nicaloceram Composites Ceram. Eng. Sci. Proc. 18, 779–786 (1997).
T. Ishikawa, S. Kajii, K. Matsunaga, T. Hogami, Y. Kohtoku, and T. NagasawaA Tough, Thermally Conductive Silicon Carbide Composite with High Strength up to 1600°C in Air Science 282, 1295–1297 (1998).
J. Ma and H. H. HngHigh Thermal Conductivity Ceramic Layered System Substrates for Microelectronic Applications J. Mater. Sci.: Mater. Electron. 13, 461–464 (2002).
A. Maqsood, M. Anis-ur-Rehman, V. Gumen, and Anwar-ur-HaqThermal Conductivity of Ceramic Fibers as a Function of Temperature and Press Load J. Phys. D: Appl. Phys. 33, 2057–2063 (2000).
M. A. WhiteProperties of Materials (Oxford, New York, 1999), pp. 270–271.
Y. Balci, M. E. Yakinci, M. A. Aksan, A. Özdes, and H. AtesThermal Conductivity Properties of Glass-Ceramic (Bi2−δ-γ GaδTlγ)Sr2Ca2Cu3O10+xHigh-TcSuperconductors J. Low Temp. Phys. 117, 963–967 (1999).
G. Suresh, G. Seenivasan, M. V. Krishnaiah, and P. S. MurtiInvestigation of the Thermal Conductivity of Selected Compounds of Gadolinium and Lanthanum J. Nucl. Mater. 249, 259–261 (1997).
G. Suresh, G. Seenivasan, M. V. Krishnaiah, and P. S. MurtiInvestigation of the Thermal Conductivity of Selected Compounds of Lanthanum, Samarium and Europium J. Alloys Comp. 269, L9–L12 (1998).
W. A. Groen, M. J. Kraan, and G. de WithPreparation, Microstructure and Properties of Magnesium Silicon Nitride (MgSiN2) Ceramics J. Europ. Ceram. Soc. 12, 413–420 (1993).
W. A. Groen, M. J. Kraan, G. de With, and M. P. A. ViegersNew Covalent Ceramics: MgSiN2 Mat. Res. Soc. Symp. Proc. 327, 239–244 (1994).
R. J. Bruls, H. T. Hintzen, and R. MetselaarProceedings of the Twenty Fourth International Thermal Conductivity Conference and Twelfth International Thermal Expansion Symposium (Pittsburgh, 1997), edited by P. S. Gaal, and D. E. Apostoleseu (Technomics, Pennsylvania, 1999), 3.
R. J. Bruls, A. A. Kudyba-Jansen, P. Gerharts, H. T. Hintzen, and R. MetselaarPreparation, Characterization and Properties of MgSiN2Ceramics J. Mater. Sci.: Mater. Electron. 13, 63–75 (2002).
E. Iguchi, T. Itoga, H. Nakatsugawa, F. Munakata, and K. FuruyaThermoelectric Properties in Bi2−x PbxSr3−y YyCo2O9−γ Ceramics J. Phys. D: Appl. Phys. 34, 1017–1024 (2001).
S. Katsuyama, Y. Takagi, M. Ito, K. Majima, H. Nagai, H. Sakai, K. Yoshimura, and K. KosugeThermoelectric Properties of (Zn1−y Mgy)1−x AlxO Ceramics Prepared by the Polymerized Complex Method J. Appl. Phys. 92, 1391–1398 (2002).
N. F. Mott and E. A. DavisElectronic Processes in Non-Crystalline Materials (Clarendon, Oxford, 1979).
D. AdlerAmorphous-Semiconductor Devices Sci. Am. 236(5), 36–48 (1977).
D. G. Cahill, J. R. Olson, H. E. Fischer, S. K. Watson, R. B. Stephens, R. H. Tait, T. Ashworth, and R. O. PohlThermal Conductivity and Specific Heat of Glass Ceramics Phys. Rev. B 44, 12226–12232 (1991).
T. Velinov and M. GateshikiThermal Conductivity of Ge-As-Se(S) Glasses Phys. Rev. B: Condensed Matter Mater. Phys. 55(17), 11014–11017 (1997).
N. A. Hegab, M. Fadel, M. A. Afifi, and M. F. ShawerTemperature Dependence of Electrical and Thermal Properties of Te82.2Ge13.22Si4.58Glassy Alloy J. Phys. D: Appl. Phys. 33, 2223–2229 (2000).
J. Philip, R. Rajesh and C. P. MenonCarrier-Type Reversal in Pb-Ge-Se Glasses: Photopyroelectric Measurements of Thermal Conductivity and Heat Capacity Appl. Phys. Lett. 78, 745–747 (2001).
A. Srinivasan, K. N. Madhusoodanan, E. S. R. Gopal, and J. PhilipObservation of a Threshold Behavior in the Optical Band Gap and Thermal Diffusivity of Ge-Sb-Se Glasses Phys. Rev. B 45, 8112–8115 (1992).
J. C. de Lima, N. Cella, L. C. M. Miranda, C. Chying An, A. H. Franzan, and N. F. LeitePhotoacoustic Characterization of Chalcogenide Glasses: Thermal Diffusivity of GexTe1−x Phys. Rev. B 46, 14186–14189 (1992).
M. F. ThorpeContinuous Deformations in Random Networks J. Non-Cryst. Solids 57, 350–370 (1983).
J. C. Phillips and M.F. ThorpeConstraint Theory, Vector Percolation and Glass Formation Solid State Commun. 53, 699–702 (1985).
J. C. PhillipsVibrational Thresholds Near Critical Average Coordination in Alloy Network Glasses Phys. Rev. B 31, 8157–8163 (1985).
N. K. Abrikosov, V. F. Bankina, L. V. Poretskaya, L. E. Shelimova, and E. V. SkudnovaSemiconducting II–VI, IV–VI and V–VI Compounds (Plenum, New York, 1969), pp. 67.
M. L. Baesso, A. C. Bento, A. R. Duarte, A. M. Neto, L.C.M. Miranda, J.A. Sampaio, T. Catunda, S. Gama and F. C. G. GandraNd2O3Doped Low Silica Calcium Aluminosilicate Glasses: Thermomechanical Properties J. Appl. Phys. 85, 8112–8118 (1999).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2004 Kluwer Academic/Plenum Publishers, New York
About this chapter
Cite this chapter
Sun, R., White, M.A. (2004). Ceramics and Glasses. In: Tritt, T.M. (eds) Thermal Conductivity. Physics of Solids and Liquids. Springer, Boston, MA . https://doi.org/10.1007/0-387-26017-X_10
Download citation
DOI: https://doi.org/10.1007/0-387-26017-X_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-306-48327-1
Online ISBN: 978-0-387-26017-4
eBook Packages: Springer Book Archive