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MEMS/NEMS pp 1252–1328Cite as

Techniques in Residual Stress Measurement for MEMS and Their Applications

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Abstract

This chapter mainly focuses on the introduction of residual stress characterization of MEMS materials. The origin and classification of residual stress appearing in thin films and MEMS structures are firstly introduced and the essential background of necessary mechanics, which is utilized to convert the measured data into the final residual stress, is followed. Various types of residual stress characterization techniques conducted in MEMS scale are subsequently addressed and reviewed. Finally, a brief discuss on controlling residual stresses and on taking the advantage of residual stress in MEMS applications is briefly discussed.

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  1. Department of Mechanical Engineering, National Cheng-Kung University Tainan, 70101, Taiwan, R.O.C.

    Kuo-Shen Chen

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    Cornelius T. Leondes

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Chen, KS. (2006). Techniques in Residual Stress Measurement for MEMS and Their Applications. In: Leondes, C.T. (eds) MEMS/NEMS. Springer, Boston, MA. https://doi.org/10.1007/0-387-25786-1_33

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