Abstract
In the past decade, considerable effort has been devoted to microelectromechanical systems (MEMS), more commonly known in Europe as microsystem technologies (MST). Silicon micromachining has become a fundamental tool that enables the fabrication of such devices. The technology has evolved from integrated circuit fabrication processes, namely film formation, doping, lithography and etching. In general, silicon micromachining can be subdivided into two categories, bulk and surface machining. In bulk micromachining, three dimensional features and micromechanical devices are realised out of single crystal silicon wafers. In contrast, surface micromachining employs thin-film layers on the substrate surface and generally involves dimensions smaller than those of bulk micromachined devices.
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Bien, D.C.S., Mitchell, N.S.J., Gamble, H.S. (2006). Micro-machined Passive Valves: Fabrication Techniques, Characterisation and their Application. In: Leondes, C.T. (eds) MEMS/NEMS. Springer, Boston, MA. https://doi.org/10.1007/0-387-25786-1_19
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