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References
Binnig, G., Rohrer, H., Gerber, C. and Weibel, E., Phys. Rev. Lett. 49, 57 (1982).
Eigler, D.M. and Schweizer, E.K., Nature 344, 524 (1990).
Feynman, R.P., Eng. Sci. 23, 22 (1960).
Moore, G.E., Proc. IEEE IEDM, 75CH1023-1, 11 (1975).
Galileo, G., 1638, Two Sciences (translated S. Drake) Wisconsin University Press, pp 12–13.
Kendall, K., J. Phys. D: Appl. Phys. 4, 1186–95 (1971).
Boussinesq, J., Application des potentiels a ľetude de ľequilibre et du mouvement des solides elastiques, Gauthier-Villars, Paris 1885 (new edition, Blanchard, Paris, 1969).
Barquins, M. and Maugis, D., J. Mec. Theor. Appl. 1, 331–57 (1982).
Griffith, A.A., Phil. Trans. R. Soc. A 221, 163–98 (1920).
Maugis, D. and Barquins, M., J. Phys. D: Appl. Phys. 16, 1843–74 (1983).
Maugis, D. and Barquins, M., J. Phys. D: Appl. Phys. 11, 1989–2023 (1978), see Maugis, D., Contact, Adhesion and Rupture of Elastic Solids, Springer, Berlin 1999, ch 4.
Johnson, K.L. Proc 14th IUTAM Congress on Theoretical and Applied Mechanics, Delft, Sept 1976, North-Holland, Amsterdam, 1977, pp 133–43.
Tylecote, R.F., The Solid Phase Welding of Metals, E Arnold, London, 1968.
Becker, R.S., Golovchenko, J.A. and Swartzentruber, B.S., Nature 325, 419–21 (1987).
Foster, J.S., Frommer, J.E. and Arnett, P.C., Nature 331, 324–6 (1988).
Eigler, D.M. and Schweitzer, E.K., Nature 344, 524–6 (1990).
Stipe, B.C., Rezaei, M.A. and Ho, W., Science, 280, 1732–5 (1998).
Manoharan, H.C., Lutz, C.P. and Eigler, D.M., Nature 403, 512–5 (2000).
Rief, M., Oesterhelt, F., Heymann, B. and Gaub, H.E., Science 275, 1295–7 (1997).
Rief, M., Gautel, M., Oesterhelt, F., Fernanderz, J.M. and Gaub, H.E., Science 276, 1109–12 (1997).
Li, H., Liu, B., Zhang, X., Gao, C., Shen, J. and Zou, G., Langmuir 15, 2120–4 (1999).
Kuhn, W and Gruen, E., Kolloid Z. 101, 248 (1942).
Hariadi, R.F., Langford, S.C. and Dickinson, J.T., J. Appl. Phys. 86, 4885 (1999).
Busnaina, A.A. and Dai, F., J. Adhesion. 67, 181–93 (1998).
Feng, J.W., Moumen, N. and Busnaina, A.A., Proc. Adhesion. Soc. 23, 349–52 (2000).
Wu, X., Sacher, E. and Meunier, M., Proc. Adhesion. Soc. 23, 360–2 (2000).
Epstein, P., Z. Phys. 54, 537 (1929).
Zhao, X.M., Wilbur, J.L. and Whitesides, G.M., Langmuir 12, 5504 (1996).
Milner, S.T., Science 251, 905 (1991).
Binder, K., Advances in Polymer Science vol 138, Springer Verlag, Berlin, 1999.
Harder, P., Grunze, M., Dahint, R., Whitesides, G. and Laibinis, P.E.J., J. Phys. Chem., B 102, 426–36 (1998).
Raphael, E. and deGennes, P.G., J. Phys. Chem. 96, 4002 (1992).
Wang, J., Kara, S., Kang, H., Long, T.E., Li, Q. and Ward, T.C., Proc. Adhesion. Soc. 23, 337–9 (2000).
Van der Vegte, E.W., Subbotin, A., Hadziioannou, G., Ashton, P.R., and Preece, J.A., Langmuir, 16, 3249–56 (2000).
Lehmann, D., Proc. Int. Electro Packaging Conf. 1993, pp 828–35.
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(2004). Nano-adhesion: Joining Materials for Electronic Applications. In: Molecular Adhesion and Its Applications. Springer, Boston, MA. https://doi.org/10.1007/0-306-48406-4_13
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