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References
D.V. Morgan and K. Board, An introduction to semiconductor microtechnology, John Wiley and Sons, p. 18, 1991
S.K. Ghandhi, The theory and practice of microelectronics, John Wiley and Sons, p. 38, 1968
J. Lindhard, M. Scharff, and H.E. Schiøtt, “Range Concepts and Heavy Ion Ranges”, Matematisk-fysiske Meddelelser Det Kongelige Danske Videnskabernes Selshab, Vol. 33, No. 14, p.1, 1963
R.S. Muller and T.I. Kaolins, Device electronics for integrated circuits, J. Wiley and Sons, pp. 81–83, 1986
J.P. Colinge, Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition, Kluwer Academic Publishers, 1997
A.S. Grove, Physics and technology of semiconductor devices, J. Wiley & Sons, p. 24, 1967
B.E. Deal and A.S. Grove, “General relationships for the thermal oxidation of silicon”, Journal of Applied Physics, Vol. 36, p. 3770, 1965
E.A. Irene, H.Z. Massoud, E. Tierney, “Silicon oxidation studies: silicon orientation effects on thermal oxidation”, Journal of the Electrochemical Society, Vol. 133, No. 6, p. 1253, 1986
S. Marshall, R.J. Zeto, C.G. Thornton, “Dry pressure local oxidation of silicon for IC isolation”, Journal of the Electrochemical Society, Vol. 122, No. 19, p. 1411, 1975
M. Miyake, “Oxidation-enhanced diffusion of ion-implanted boron in silicon in extrinsic conditions”, Journal of Applied Physics, Vol. 57, No. 6, p. 1861, 1985
A.S. Grove, Physics and technology of semiconductor devices, J. Wiley & Sons, p. 70, 1967
E. Kooi and J.A. Appels, “Selective oxidation of silicon and its device applications”, Journal of the Electrochemical Society, Vol. 120, No. 3, Abstracts of the Electrochemical Society Meeting, Chicago, IL, USA, p. 101C, 1973
B. Davarik, C.W. Koburger, R. Schulz, J.D. Warnock, T. Furukawa, M. Jost, Y. Taur, W.G. Schwittek, J.K. DeBrosse, M.L. Kerbaugh, and J.L. Mauer, “A new planarization technique, using a combination of RIE and chemical mechanical polish (CMP)”, Technical Digest of the International Electron Devices Meeting, p. 61, 1989
T. Kaolins, Poly crystalline silicon for integrated circuit applications, Kluwer Academic Publishers, 1988
A.S. Grove, Physics and technology of semiconductor devices, J. Wiley & Sons, p. 12, 1967
H. Taub and D. Schilling, Digital integrated electronics, Mc Graw-Hill, p. 263, 1977
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(2002). Semiconductor Processing. In: Physics of Semiconductor Devices. Springer, Boston, MA. https://doi.org/10.1007/0-306-47622-3_11
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DOI: https://doi.org/10.1007/0-306-47622-3_11
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