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Experimental Studies on the Evolution of Defect Temperature Field during Deformation of ABS

  • Conference paper
IUTAM Symposium on Rheology of Bodies with Defects

Part of the book series: Solid Mechanics and its Applications ((SMIA,volume 64))

Abstract

The process of defect evolution is complicated which cuts across micro-, meso- and macroscale levels, and should be inherently characterized by its rheology and dissipation. Experiments of heat generation induced by any irreversible deformation in the tensile failure process of thermoplastics with prefabricated defects have been made in details. The initiation and evolution laws of the local temperature field near defects are observed and recorded with infrared photography, and then preliminarily analyzed. It is shown that the heat generated during defect evolution is significant in our experiments and comprises some 25 to 70 per cent of the of external work, so its contribution to the failure of materials is not negligible. Considering the micro- and mesoscopic characters of deformation, a preliminary and qualitative explanation to the cooling and heating phenomena observed in the experiments is also presented in this paper.

Project 19632030 supported by National Natural Science Foundation of China.

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Authors and Affiliations

  1. Institute of Rheological Mechanics, Xiangtan University, Hunan, 411105, P.R.C.

    Wenbo Luo

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  1. Wenbo Luo
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Editors and Affiliations

  1. Department of Mechanics and Engineering Sciences, Peking University, Beijing, China

    Ren Wang

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© 1999 Kluwer Academic Publishers

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Luo, W. (1999). Experimental Studies on the Evolution of Defect Temperature Field during Deformation of ABS. In: Wang, R. (eds) IUTAM Symposium on Rheology of Bodies with Defects. Solid Mechanics and its Applications, vol 64. Springer, Dordrecht. https://doi.org/10.1007/0-306-46937-5_9

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  • DOI: https://doi.org/10.1007/0-306-46937-5_9

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-0-7923-5297-6

  • Online ISBN: 978-0-306-46937-4

  • eBook Packages: Springer Book Archive

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