Conclusions
The deposition rate of PTFE varied nearly linearly with RF power density. High rates of deposition could be achieved owing to its temperature tolerance allowing higher power densities. The coatings retained PTFE-like properties with good adhesion. PVDF sputtered at rates that were nonlinear with RF power density, resulting in coatings with variable adhesion. However, at equivalent power densities, PVDF sputtered at about twice the rate of PTFE. FEP sputtered at high rates for low power densities, about four times that of PVDF for the same power density. However, low rates resulted in film degradation as evidenced by film discoloration.
This work has shown that it is possible to deposit a number of fluoropolymer films by RF magnetron sputtering by carefully controlling the rate of deposition to degree of ion bombardment during film formation. Films from 20 nm to 15 μm have been produced that are of high integrity and adherent. The fluoropolymers deposited in this study included PTFE, PVDF, and FEP; of these only PTFE had been extensively studied by RF magnetron sputtering prior to this work.
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Lawson, K.J., Nicholls, J.R. (2002). Ultrathin PTFE, PVDF, and FEP Coatings Deposited Using Plasma-assisted Physical Vapor Deposition. In: Hougham, G., Cassidy, P.E., Johns, K., Davidson, T. (eds) Fluoropolymers 1: Synthesis. Topics in Applied Chemistry. Springer, Boston, MA. https://doi.org/10.1007/0-306-46918-9_19
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