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Analysis on Transient Thermal Behaviors of the Novel Vapor Chamber

  • Yao Chen
  • Yaping ZhangEmail author
  • Pei Wang
  • Yongxin Guo
Conference paper
  • 212 Downloads
Part of the Environmental Science and Engineering book series (ESE)

Abstract

A heat pipe substrate module diffused heat by phase change was designed, and transient thermal properties of the vapor chamber were analyzed. The time of the vapor chamber to get steady-state mainly depends on the heat transfer coefficient. As the heat transfer coefficient increases, the time to reach steady state is shorter. Reducing the temperature drop of the vapor chamber core portion can effectively improve thermal performance for the vapor chamber. The transient temperature rise of vapor chamber tube core is smaller than that of the pure copper substrate module and the air heat pipe substrate module with fixed thermal resistance, it is beneficial to overcome the power “swell” and improve thermal shock resistance of the power device. The thermal resistance of the heat sink accounts for more than 70% of the thermal resistance of the entire heat dissipation module. The transient thermal performance of the vapor chamber and the power module integrated packaged can ensure thermal diffusion efficient and smooth operation.

Keywords

Vapor chamber Thermal performance Transient behaviors Substrate 

Notes

Acknowledgements

The project is supported by the National Natural Science Foundation of China (Grant No. 51504188).

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Copyright information

© Springer Nature Singapore Pte Ltd. 2020

Authors and Affiliations

  1. 1.Xi’an University of Science and TechnologyXi’anChina

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