Thermal Performance Simulation Analysis of the Novel Micro Heat Pipe

  • Pei Wang
  • Yaping ZhangEmail author
  • Yongxin Guo
  • Yao Chen
Conference paper
Part of the Environmental Science and Engineering book series (ESE)


To solve the heat dissipation problem of high power integrated electronic equipment, a micro heat pipe radiator proposed by the composite plane wall algorithm the thermal resistance has been calculated, an equivalent thermal conductivity of plate heat pipe was determined. The distribution temperature at different heating power was obtained. The comparison was shown that the advantage of heat transfer of the novel micro heat pipe was more visible, and the average temperature of the substrate surface was lower 7 °C than that of the traditional micro heat pipe. By simulation, it was shown that the micro heat pipe effectively diffuses concentrated heat flux and had a proper and uniform temperature characteristic at high heat flux. The variation trend of chip temperature and heat resistance of radiator was carried out by analyzing the effects of heating power on heat transfer performance of the radiator respectively and avoiding the thermal stress concentration of the substrate.


Heat pipe Thermal performance Electronics cooling Heat flux 



The project is supported by the National Natural Science Foundation of China (Grant No. 51504188).


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© Springer Nature Singapore Pte Ltd. 2020

Authors and Affiliations

  1. 1.Xi’an University of Science and TechnologyXi’anChina

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