Study on the Effects of Channel Deployment in a S-Shaped Liquid Cooling Heat Sink for Electronic Chip Cooling

  • Zhihao Lu
  • Kai ZhangEmail author
  • Jinxiang Liu
Conference paper
Part of the Environmental Science and Engineering book series (ESE)


The air conditioning in data center should be running in cold mode throughout the year account for amount of heat released in a relatively small space of rack. However, most of the heat in data center is released from electronic chips. Thus, the energy consumption of air conditioning will be significantly decreased if the heat released by electronic chips can be mitigated directly. Compared to the air cooling heat sink (ACHS), the cooling performance of liquid cooling heat sink (LCHS) is dramatically improved as it can remove more heat from the surface of electronic chip quickly. To further improve the cooling performance of LCHS, the effects of channel deployment are investigated in a commonly used S-shaped LCHS in this study. The numerical simulation results show that the average surface temperature of electronic chip can be reduced by 22.91 °C while the number of channels is increased from one to five.


Liquid heat sink S-shaped Electronic chip cooling 



This work is supported by grants from the National Natural Science Foundation of China (No. 51878342) and Jiangsu Provincial Department of Housing and Urban Rural Construction (No. 2018ZD067).


  1. 1.
    Qian, X.D., Li, Z., Li, Z.X.: A thermal environmental analysis method for data centers. Heat Mass Transf. 62, 579–585 (2013)CrossRefGoogle Scholar
  2. 2.
    Cho, J., Yang, J., Park, W.: Evaluation of air distribution system’s airflow performance for cooling energy savings in high-density data centers. Energy Build. 68, 270–279 (2014)CrossRefGoogle Scholar
  3. 3.
    Almoli, A., Thompson, A., Kapur, N., Summers, J., Thompson, H., Hannah, G.: Computational fluid dynamic investigation of liquid rack cooling in data centres. Appl. Energy 89(1), 150–155 (2012)CrossRefGoogle Scholar
  4. 4.
    Patankar, S.V.: Airflow and cooling in a data center. Heat Transf.-Trans. ASME 132(7), 1–17 (2010)Google Scholar
  5. 5.
    Zhang, J.R., Zhang, T.T., Prakash, S., Jaluria, Y.: Experimental and numerical study of transient electronic chip cooling by liquid flow in microchannel heat sinks. Numer. Heat Transf. 65(7), 627–643 (2014)CrossRefGoogle Scholar
  6. 6.
    Tan, H., Wu, L.W., Wang, M.Y., Yang, Z.H., Du, P.G.: Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling. Heat Mass Transf. 129, 681–689 (2019)CrossRefGoogle Scholar
  7. 7.
    Zhang, H.Y., Pinjala, D., Wong, T.N., Toh, K.C., Joshi, Y.K.: Single-phase liquid cooled microchannel heat sink for electronic packages. Appl. Therm. Eng. 25(10), 1472–1487 (2005)CrossRefGoogle Scholar
  8. 8.
    Joshi, Y., Pramod, K.: Energy efficient thermal management of data centers, 1st edn. Springer, Boston (2012)CrossRefGoogle Scholar
  9. 9.
    Kondo, Y., Matsushima, H.: Forced air cooling for CPU modules with high heat dissipation. Heat Transf. Asian Res. 31(3), 226–236 (2002)CrossRefGoogle Scholar
  10. 10.
    Marques, C., Kelly, K.: Fabrication and performance of a pin fin micro heat exchanger. J. Heat Transf. 126(3), 434–444 (2004)CrossRefGoogle Scholar
  11. 11.
    Xie, X.L., Liu, Z.J., He, Y.L., Tao, W.Q.: Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink. Appl. Therm. Eng. 29(1), 64–74 (2009)CrossRefGoogle Scholar
  12. 12.
    Tuckerman, D.B., Pease, R.F.W.: High-performance heat sinking for VLSI. IEEE Electron. Device Lett. 2(5), 126–129 (1981)CrossRefGoogle Scholar
  13. 13.
    Ji, L., Peterson, G.P.: Geometric optimization of a micro heat sink with liquid flow. IEEE Trans. Compon. Pack. Technol. 29(1), 145–154 (2006)CrossRefGoogle Scholar
  14. 14.
    Ji, L., Peterson, G.P.: 3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow. Heat Mass Transf. 50(15–16), 2895–2904 (2007)zbMATHGoogle Scholar
  15. 15.
    Ma, D.D., Xia, G.D., Wang, J., Yang, Y.C., Jia, Y.T., Zong, L.X.: An experimental study on hydrothermal performance of microchannel heat sinks with 4-ports and offset zigzag channels. Energy Convers. Manag. 152, 157–165 (2017)CrossRefGoogle Scholar
  16. 16.
    Hajmohammadi, M.R., Toghraei, I.: Optimal design and thermal performance improvement of a double-layered microchannel heat sink by introducing Al2O3 nano-particles into the water. Stat. Mech. Appl. 505, 328–344 (2018)CrossRefGoogle Scholar
  17. 17.
    Wang, Y.K., Zhang, J., Zhang, Y., Geng, L.L.: Simulation Technology and Additive Manufacturing, 2nd edn. Publishing House of Electronics Industry, Beijing (2019)Google Scholar
  18. 18.
    Cai, Z.J., Long, T.Y.: Fluid Mechanics & Pumps and Fans, 5th edn. China Architecture & Building Press, Beijing (2009)Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2020

Authors and Affiliations

  1. 1.College of Urban ConstructionNanjing Tech UniversityNanjingChina

Personalised recommendations