Advertisement

Trends in Heterogeneous Integrations

  • John H. LauEmail author
Chapter

Abstract

Semiconductor industry has identified five main growth engines (applications), namely (1) mobile, (2) high-performance computing (HPC), (3) automotive (especially self-driving car), (4) internet of things (IoTs), and (5) big data (especially for cloud computing).

References

  1. 1.
    Lau, J. H., P. Tzeng, C. Lee, C. Zhan, M. Li, J. Cline, et al., “Redistribution Layers (RDLs) for 2.5D/3D IC Integration”, IMAPS Transactions, Journal of Microelectronic Packaging, Vol. 11, No. 1, First Quarter 2014, pp. 16–24.Google Scholar
  2. 2.
    Lau, J. H., “Redistribution-Layers for Heterogeneous Integrations”, Chip Scale Review, January/February 2019, pp. 20–25.Google Scholar
  3. 3.
    Li, L., P. Chia, P. Ton, M. Nagar, S. Patil, J. Xue, J. DeLaCruz, M. Voicu, J. Hellings, B. Isaacson, M. Coor, and R. Havens, “3D SiP with organic interposer of ASIC and memory integration”, Proceedings of IEEE/ECTC, May 2016, pp. 1445–1450.Google Scholar
  4. 4.
    Shimizu, N., Kaneda, W., Arisaka, H., Koizumi, N., Sunohara, S., Rokugawa, A., and T. Koyama, “Development of Organic Multi Chip Package for High Performance Application”, IMAPS International Symposium on Microelectronics, Orlando, FL, September 30–October 3, 2013, pp. 414–419.Google Scholar
  5. 5.
    Oi, K., Otake, S., Shimizu, N., Watanabe, S., Kunimoto, Y., Kurihara, T., Koyama, T., Tanaka, M., Aryasomayajula, and Z. Kutlu, “Development of New 2.5D Package With Novel Integrated Organic Interposer Substrate With Ultra-Fine Wiring and High Density Bumps”, IEEE 64th Electronic and Components Technology Conference, Orlando, FL, May 27–30, 2014, pp. 348–353.Google Scholar
  6. 6.
    Lau, J. H., 3D IC Integration and Packaging, McGraw-Hill, New York, 2016.Google Scholar
  7. 7.
    Lau, J. H., Through-Silicon Via (TSV) for 3D Integration, McGraw-Hill, New York, 2013.Google Scholar
  8. 8.
    Stow, D., Y. Xie, T. Siddiqua, and G. H. Loh, “Cost-effective design of scalable high-performance systems using active and passive interposers”, Proceedings of IEEE/ACM International Conference on Computer-Aided Design, November 2017, pp. 728–735.Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.ASM Pacific TechnologyHong KongHong Kong

Personalised recommendations