Signal Integrity Analysis for Diameter-Dependent Mixed Carbon Nanotube Bundle Interconnects
Recent VLSI technology considers the structure and modeling approach of mixed carbon nanotube bundle (MCB) interconnects. Initially, this research paper models different MCB structures by considering diameter-dependent modeling of interconnect parasitics. Finally, the unique models are used to study the effect of signal integrity using multi-line bus architecture. Crosstalk induced delay is analyzed by various dimensions of MCB using lengths which vary from 100 to 500 µm of global interconnects. Using industry standard HSPICE circuit simulations, it is observed that the overall improvement in crosstalk induced delay is 6.8% for novel MCB structure having single- and multi-walled CNTs (SWCNT and MWCNT) as compared to MCB containing SW- and DWCNT.
KeywordsMixed CNT bundle (MCB) Carbon nanotube (CNT) Signal integrity Propagation delay Interconnect Crosstalk
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