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Lifetime Prediction Method of Components Based on Failure Physics

  • Li Liu
  • Zhimin DingEmail author
  • Nan Fang
  • Chao Duan
  • Nan Li
  • Qianqian Lv
  • Miao Zhang
Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 550)

Abstract

With more and more extensive application of microelectronic devices, the production cost and performance requirements of semiconductor devices will be replaced by the reliability requirements. The reliability test must be carried out in a bid to analyze and evaluate the reliability of device and predict its life from failure mechanism. Under the normal work conditions, in order to obtain the reliability data of devices faster, it is usual to adopt accelerated life test. Besides, the efforts will be made to analyze the corresponding device failure models in accordance with its failure mechanism and adopt various life prediction models and methods. The reliability of the semiconductor device directly affects the working life of the device. After the accelerated test, people can establish all kinds of lifetime forecasting models and methods by analyzing the failure mechanism of semiconductor devices. This paper minutely summarizes the evolution process of the methods that are used to forecast the life of semiconductor devices and based on failure physics, and then, these methods will be introduced in detail with their corresponding reliability problems. There are five models for accelerated test showed at the end of the paper.

Keywords

Life prediction Failure mechanism Evolution process Model Method 

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Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Li Liu
    • 1
  • Zhimin Ding
    • 1
    Email author
  • Nan Fang
    • 1
  • Chao Duan
    • 1
  • Nan Li
    • 1
  • Qianqian Lv
    • 1
  • Miao Zhang
    • 1
  1. 1.China Aerospace Components Engineering CenterBeijingChina

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