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Effect of Cu Content on Microstructure and Properties of Al–Mg–Si Alloy

  • Hong-Xiang Li
  • Shengli GuoEmail author
  • Peng Du
  • Sheng-Pu Liu
Conference paper
Part of the Springer Proceedings in Physics book series (SPPHY, volume 217)

Abstract

The effect of Cu content on the microstructure and properties of Al–Mg–Si alloy was studied by optical microscopy scanning electron microscopy, transmission electron microscopy, and tensile test. The state of the heat treatment is directly aged at 165 °C after a solid solution. The results show that with the increase of Cu content, the tensile strength of Al–Mg–Si alloy first increases and then decreases, and the conductivity has no obvious change. When the content of Cu is 0.3%, the tensile strength of Al–Mg–Si alloy is significantly increased to 336 MPa and the electrical conductivity is 49.6% IACS.

Keywords

Al–Mg–Si alloy Cu content Microstructure and properties 

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Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Hong-Xiang Li
    • 1
  • Shengli Guo
    • 1
    Email author
  • Peng Du
    • 1
  • Sheng-Pu Liu
    • 1
  1. 1.General Research Institute for Non-ferrous MetalsBeijingChina

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