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Investigation into the Realization of a Single Atomic Layer Removal in Nanoscale Mechanical Machining of Single Crystalline Copper

  • Pengzhe ZhuEmail author
  • Jianyong Li
Chapter
Part of the Springer Tracts in Mechanical Engineering book series (STME)

Abstract

It is widely believed that the minimum depth of material removal of single crystalline workpieces is one single atomic layer in nanoscale mechanical machining. However, direct evidence for this is still lacking. In this work, the minimum depth of material removal of single crystalline copper in nanoscale mechanical machining is investigated through nanoscratching using molecular dynamics simulations. We demonstrate that the minimum depth of material removal of copper workpiece can achieve a single atomic layer under certain machining conditions in nanoscale machining process. It is found that the minimum depth of material removal is closely associated with the crystal orientation and scratching direction of copper workpiece. Our results also demonstrate that even when the depth of material removal is a single atomic layer of copper workpiece under certain machining conditions, the workpiece material is not removed in a layer-by-layer fashion, which rejects the hypothesis that single crystalline metal materials can be continuously and stably removed one layer of atoms after another in nanoscale mechanical machining. These understandings not only shed light on the material removal mechanism in nanoscale mechanical machining but also provide insights into the control and optimization of nanoscale machining process.

Notes

Acknowledgements

This work is supported by the National Natural Science Foundation of China (Grant No. 51405337), the Specialized Research Fund for the Doctoral Program of Higher Education (Grant No. 20130032120065), and the Natural Science Foundation of Tianjin (No. 15JCQNJC04800).

The original work is published in Computational Materials Science (2016, 118:192–202), and the support of Elsevier BV is acknowledged.

References

  1. 1.
    Masayoshi E, Takahito O (2003) MEMS/NEMS by micro nanomachining. IEICE Technical Report, vol 103, 13–18Google Scholar
  2. 2.
    Schumacher HW, Keyser UF, Zeitler U, Haug RJ, Ebert K (2000) Controlled mechanical AFM machining of two-dimensional electron systems: fabrication of a single-electron transistor. Phys E 6:860–863CrossRefGoogle Scholar
  3. 3.
    Sohn LL, Willett RL (1995) Fabrication of nanostructures using atomic-force-microscope-based lithography. Appl Phys Lett 67:1552–1554CrossRefGoogle Scholar
  4. 4.
    Dornfeld D, Min S, Takeuchi Y (2006) Recent advances in mechanical micromachining. CIRP Ann 55:745–768CrossRefGoogle Scholar
  5. 5.
    Brinksmeier E et al (2010) Ultra-precision grinding. CIRP Ann 59:652–671CrossRefGoogle Scholar
  6. 6.
    Tseng AA (2011) Removing material using atomic force microscopy with single- and multiple-tip sources. Small 7:3409–3427CrossRefGoogle Scholar
  7. 7.
    Fang FZ, Wu H, Liu YC (2005) Modeling and experimental investigation on nanometric cutting of monocrystalline silicon. Int J Mach Tools Manuf 45:1681–1686CrossRefGoogle Scholar
  8. 8.
    Fang FZ, Wu H, Zhou W, Hu XT (2007) A study on mechanism of nano-cutting single crystal silicon. J Mater Process Technol 184:407–410CrossRefGoogle Scholar
  9. 9.
    Pei QX, Lu C, Lee HP (2007) Large scale molecular dynamics study of nanometric machining of copper. Comput Mater Sci 41:177–185CrossRefGoogle Scholar
  10. 10.
    Komanduri R, Varghese S, Chandrasekaran N (2010) On the mechanism of material removal at the nanoscale by cutting. Wear 269:224–228CrossRefGoogle Scholar
  11. 11.
    Ikawa N, Shimada S, Tanaka H (1992) Minimum thickness of cut in micromachining. Nanotechnology 3:6–9CrossRefGoogle Scholar
  12. 12.
    Shimada S, Ikawa N, Tanaka H, Ohmori G, Uchikoshi J (1993) Feasibility study on ultimate accuracy in microcutting using molecular dynamics simulation. CIRP Ann 42:117–120CrossRefGoogle Scholar
  13. 13.
    Yuan ZJ, Zhou M, Dong S (1996) Effect of diamond tool sharpness on minimum cutting thickness and cutting surface integrity in ultraprecision machining. J Mater Process Technol 62:327–330CrossRefGoogle Scholar
  14. 14.
    Liu X, Devor RE, Kapoor SG (2006) An analytical model for the prediction of minimum chip thickness in micromachining. J Manuf Sci Eng 128:474–481CrossRefGoogle Scholar
  15. 15.
    Son SM, Lim HS, Ahn JH (2005) Effects of the friction on the minimum cutting thickness in micro cutting. Int J Mach Tools Manuf 45:529–535CrossRefGoogle Scholar
  16. 16.
    Lai XM, Li HT, Lin CF, Lin ZQ, Ni J (2007) Modeling and analysis of micro scale milling considering size effect, micro cutter edge radius and minimum chip thickness. Int J Mach Tools Manuf 48:1–14CrossRefGoogle Scholar
  17. 17.
    Malekian M, Mostofa MG, Park SS, Jun MB (2012) Modeling of minimum uncut chip thickness in micro machining of aluminum. J Mater Process Technol 212:553–559CrossRefGoogle Scholar
  18. 18.
    Li Z, Huang Y, Zhang J, Yan Y, Sun Y (2013) Atomistic insight into the minimum wear depth of Cu(111) surface. Nano. Res. Lett. 8:514CrossRefGoogle Scholar
  19. 19.
    Luan BQ, Robbins MO (2005) The breakdown of continuum models for mechanical contacts. Nature 435:929–932CrossRefGoogle Scholar
  20. 20.
    Luan B, Robbins MO (2006) Contact of single asperities with varying adhesion: comparing continuum mechanics to atomistic simulations. Phys Rev E 74:026111CrossRefGoogle Scholar
  21. 21.
    Urbakh M, Klafter J, Gourdon D, Israelachvili J (2004) The nonlinear nature of friction. Nature 430:525–528CrossRefGoogle Scholar
  22. 22.
    Szlufarskal I, Chandross M, Carpick RW (2008) Recent advances in single-asperity nanotribology. J Phys D Appl Phys 41:123001CrossRefGoogle Scholar
  23. 23.
    Si LN, Guo D, Luo JB, Lu XC (2010) Monoatomic layer removal mechanism in chemical mechanical polishing process: a molecular dynamics study. J Appl Phys 107:064310CrossRefGoogle Scholar
  24. 24.
    Custance O, Perez R, Morita S (2009) Atomic force microscopy as a tool for atom manipulation. Nat Nanotech 4:803–810CrossRefGoogle Scholar
  25. 25.
    Morita S (2011) Atom world based on nano-forces: 25 years of atomic force microscopy. J Electron Spectrosc 60:S199–S211Google Scholar
  26. 26.
    Kawai K et al (2014) Atom manipulation on an insulating surface at room temperature. Nat Common 5:4403CrossRefGoogle Scholar
  27. 27.
    Gotsmann B, Lantz M (2008) Atomistic wear in a single asperity sliding contact. Phys Rev Lett 101:125501CrossRefGoogle Scholar
  28. 28.
    Bhaskaran H et al (2010) Ultralow nanoscale wear through atom-by-atom attrition in silicon-containing diamond-like carbon. Nat Nanotech 5:181–185CrossRefGoogle Scholar
  29. 29.
    Jacobs T, Carpick RW (2013) Nanoscale wear as a stress-assisted chemical reaction. Nat Nanotech 8:108–112CrossRefGoogle Scholar
  30. 30.
    Moriwaki T, Okuda K (1989) Machinability of copper in ultra-precision micro diamond cutting. CIRP Ann 38:115–118CrossRefGoogle Scholar
  31. 31.
    Lucca DA, Seo YW, Rhorer RL (1994) Energy dissipation and tool-workpiece contact in ultra-precision machining. Tribol Trans 37:651–655CrossRefGoogle Scholar
  32. 32.
    Komanduri R, Raff LM (2001) A review on the molecular dynamics simulation of machining at the atomic scale. Proc I Mech E Part B 215:1639–1672CrossRefGoogle Scholar
  33. 33.
    Yan YD, Sun T, Dong S, Luo XC, Liang YC (2006) Molecular dynamics simulation of processing using AFM pin tool. Appl Surf Sci 252:7523–7531CrossRefGoogle Scholar
  34. 34.
    Fang T, Weng C (2000) Three-dimensional molecular dynamics analysis of processing using a pin tool on the atomic scale. Nanotechnology 8:148–153CrossRefGoogle Scholar
  35. 35.
    Zhu PZ, Hu YZ, Ma TB, Wang H (2010) Study of AFM-based nanometric cutting process using molecular dynamics. Appl Surf Sci 256:7160–7165CrossRefGoogle Scholar
  36. 36.
    Shi J, Shi Y, Liu CR (2010) Evaluation of three dimensional single point turning at atomistic level by molecular dynamics simulation. Int J Adv Manuf Technol 8:161–171Google Scholar
  37. 37.
    Tong Z, Liang Y, Jiang X, Luo X (2014) An atomistic investigation on the mechanism of machining nanostructures when using single tip and multi-tip diamond tools. Appl Surf Sci 290:458–465CrossRefGoogle Scholar
  38. 38.
    Li J, Fang QH, Liu YW, Zhang LC (2014) A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding. Appl Surf Sci 303:331–343CrossRefGoogle Scholar
  39. 39.
    Hu CK et al (1995) Copper interconnection: integration and reliability. Thin Solid Films 262:84–92CrossRefGoogle Scholar
  40. 40.
    Lyshevski SE (2002) MEMS and NEMS: systems, devices, and structures. CRC Press, Boca Raton, FLCrossRefGoogle Scholar
  41. 41.
    Plimpton S (1995) Fast parallel algorithms for short-range molecular dynamics. J Comput Phys 117:1–19CrossRefGoogle Scholar
  42. 42.
    Ziegenhain G, Urbassek HM, Hartmaier A (2010) Influence of crystal anisotropy on elastic deformation and onset of plasticity in nanoindentation: a simulational study. J Appl Phys 107:061807CrossRefGoogle Scholar
  43. 43.
    Komanduri R, Chandrasekaran N, Raff LMMD (2000) Simulation of nanometric cutting of single crystal aluminum-effect of crystal orientation and direction of cutting. Wear 242:60–88CrossRefGoogle Scholar
  44. 44.
    Rapaport DC (1995) The art of molecular dynamics simulation. Cambridge University Press, CambridgezbMATHGoogle Scholar
  45. 45.
    Zhou XW, Johnson RA, Wadley HNG (2004) Misfit-energy-increasing dislocations in vapor-deposited CoFe/NiFe multilayers. Phys Rev B 69:144113CrossRefGoogle Scholar
  46. 46.
    Daw MS, Baskes MI (1984) Embedded atom method: derivation and application to impurities, surfaces and other defects in metals. Phys Rev B 29:6443CrossRefGoogle Scholar
  47. 47.
    Zhou XW et al (2001) Atomic scale structure of sputtered metal multilayers. Acta Mater 49:4005CrossRefGoogle Scholar
  48. 48.
    Khomenko AV, Prodanov NV, Persson BNJ (2013) Atomistic modelling of friction of Cu and Au nanoparticles adsorbed on graphene. Condens Matter Phys 16:33401CrossRefGoogle Scholar
  49. 49.
    Zhu PZ, Hu YZ, Ma TB, Wang H (2011) Molecular dynamics study on friction due to ploughing and adhesion in nanometric scratching process. Tribol Lett 41:41–46CrossRefGoogle Scholar
  50. 50.
    Maekawa K, Itoh A (1995) Friction and tool wear in nano-scale machining—a molecular dynamics approach. Wear 188:115–122CrossRefGoogle Scholar
  51. 51.
    Shimizu J, Eda H, Zhou L, Okabe H (2008) Molecular dynamics simulation of adhesion effect on material removal and tool wear in diamond grinding of silicon wafer. Tribol Online 3:248–253CrossRefGoogle Scholar
  52. 52.
    Zhu PZ, Fang FZ (2012) Molecular dynamics simulations of nanoindentation of monocrystalline Germanium. Appl Phys A 108:415–421CrossRefGoogle Scholar
  53. 53.
    Rentsch R, Inasaki I (1994) Molecular dynamics simulation for abrasive processes. CIRP Ann 43:327–330CrossRefGoogle Scholar
  54. 54.
    Li Q, Dong Y, Perez D, Martini A, Carpick RW (2011) Speed dependence of atomic stick-slip friction in optimally matched experiments and molecular dynamics simulations. Phys Rev Lett 106:126101CrossRefGoogle Scholar
  55. 55.
    Egberts P et al (2013) Environmental dependence of atomic-scale friction at graphite surface steps. Phys Rev B 88:035409CrossRefGoogle Scholar
  56. 56.
    Çakīr O, Yardimeden A, Ozben T, Kilickap E (2007) Selection of cutting fluids in machining processes. J Achieve Mater Manuf Eng 25:99–102Google Scholar
  57. 57.
    Zhou LB, Hosseini BS, Tsuruga T, Shimizu J, Eda H (2007) Fabrication and evaluation for extremely thin Si wafer. Int J Abras Technol 1:94–105CrossRefGoogle Scholar
  58. 58.
    Hu XL, Sundararajan S, Martini A (2014) The effects of adhesive strength and load on material transfer in nanoscale wear. Comput Mater Sci 95:464–469CrossRefGoogle Scholar
  59. 59.
    Barthel AJ, Al-Azizi A, Surdyka ND, Kim SH (2014) Effects of gas or vapor adsorption on adhesion, friction, and wear of solid interfaces. Langmuir 30:2977–2992CrossRefGoogle Scholar
  60. 60.
    Ryan KE et al (2014) Simulated adhesion between realistic hydrocarbon materials: effects of composition, roughness, and contact point. Langmuir 30:2028–2037CrossRefGoogle Scholar
  61. 61.
    Kelchner CL, Plimpton SJ, Hamilton JC (1998) Dislocation nucleation and defect structure during surface indentation. Phys Rev B 58:11085–11088CrossRefGoogle Scholar
  62. 62.
    Zhu PZ, Hu YZ, Wang H, Ma TB (2011) Study of effect of indenter shape in nanometric scratching process using molecular dynamics. Mater Sci Eng, A 528:4522–4527CrossRefGoogle Scholar
  63. 63.
    Dieter GE (1986) Mechanical metallurgy. McGraw-Hill, New YorkGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  1. 1.School of Mechanical, Electronic and Control EngineeringBeijing Jiaotong UniversityBeijingChina

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