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Flexible IC Interconnection and Electrical Continuity Verification

  • Xiaosong Ma
  • Bo Xu
  • Yuelin Chen
  • Yongfa Cheng
  • Feiyang Liu
  • Zhishen Liang
  • Baiqiang Chen
  • Shiwang Li
  • Hachong Mo
  • Zhengqi Zhong
  • Hua Wang
Conference paper
Part of the Lecture Notes in Mechanical Engineering book series (LNME)

Abstract

As the device miniaturization, the assembly is becoming more and more dense. The current fine pitch package or micro BGA and other forms of interconnection comes to a certain limit, which hinders the development of packaging and assembly. high-density assembly and packaging is facing a lot of new challenges. Today, even the most of the fine pitch packages’ pitch maintained at around 0.3 mm, it is difficult to continue to shrink, because with the pitch further smaller, there will be serious problems. For example: package reliability to be reduced, such as the emergence of lead bridging, solder ball, cold solder joints and other issues. In order to solve these problems, this paper presents a new way of interconnection. The conductive function is achieved by the conductive silicone rubber between the pad on the PCB and the lead of the packaged device. Due to the presence of pressure, the conductive adhesive is deformed and can be contacted from the top to the bottom and interconnection is formed. This interconnection form may be adapted to all conductive patterns depending on the spacing of the conductive layers. Conductive adhesive in the conductive material is generally carbon, metal, metal oxide, carrying capacity between 800–2800 mA/mm2. The current production of conductive silicone spacing between 0.1–0.05 mm. Through this technology, the size of the packages can be greatly reduced, and the assembly density can be greatly improved.

Keywords

Conductive silicone Interconnection Surface mount technology Electronic packages 

Notes

Acknowledgment

Thanks to the Guilin Bureau of Science and Technology and Guangxi Bureau of Science and Technology to support this project.

References

  1. 1.
    Danielson, H.: Surface Mount Technology with Fine Pitch Components: The Manufacturing Issues. Chapman and Hall, London (1995)Google Scholar
  2. 2.
    Wu, H., Wu, X.: Advances in conductive adhesives for electronic component packaging. Mater. Newsp. 18(6), 84–85 (2004)Google Scholar
  3. 3.
    Pan, J., Tonkay, G.L., Storer, R.H., Sallade, R.M., Leandri, D.J.: Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP. IEEE Trans. Electron. Packag. Manuf. 27, 125–132 (2004)CrossRefGoogle Scholar
  4. 4.
    Wang, J.-H., Chen, Y.-H., Wang, J.-C., et al.: Advances in conductive type adhesive. Insul. Mater. 4, 67–72 (2005)Google Scholar
  5. 5.
    Mulgaonker, S., Chambers, B., Mahalingam, M., Ganesan, G., Hause, V., Berg, H.: Thermal performance limits of the QFP family. IEEE Trans. Compon. Packag. Manuf. Technol. Part A: 17, 573–582 (1994)CrossRefGoogle Scholar
  6. 6.
    Lau, J.H., Pao, Y.-H.: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. McGraw-Hill Professional Publishing, London (1997)Google Scholar
  7. 7.
    Chen, D., Gu, Y., Chen, X.: Foreign microelectronics assembly with conductive adhesive research progress. Electron. Compon. Mater. 28, 25–32 (2006)Google Scholar
  8. 8.
    Li, Y., Wong, C.: Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater. Sci. Eng. Rep. 51(1–3), 1–35 (2006)CrossRefGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Xiaosong Ma
    • 1
  • Bo Xu
    • 1
  • Yuelin Chen
    • 1
  • Yongfa Cheng
    • 1
  • Feiyang Liu
    • 1
  • Zhishen Liang
    • 1
  • Baiqiang Chen
    • 1
  • Shiwang Li
    • 1
  • Hachong Mo
    • 2
  • Zhengqi Zhong
    • 2
  • Hua Wang
    • 2
  1. 1.Guilin University of Electronic TechnologyGuilinChina
  2. 2.Hengchang Electronic Technology Lit. Co.GuilinChina

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