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Analysis and Simulation of HV-CMOS Assemblies for the CLIC Vertex Detector

  • M. Buckland
  • on behalf of the CLICdp collaboration
Conference paper
Part of the Springer Proceedings in Physics book series (SPPHY, volume 213)

Abstract

One of the design concepts currently under study for the vertex detector at the proposed Compact Linear Collider is a High-Voltage CMOS sensor, fabricated in a commercial 180 nm technology, capacitively coupled to a hybrid readout chip. Tests of the assemblies were carried out at the CERN SPS using 120 GeV/c pions, covering incident angles ranging from \(0^{\circ }\) to \(80^{\circ }\). The measurements have shown an excellent tracking performance with an efficiency above 99.7% and a spatial resolution of \(5\,\upmu \hbox {m}\) to \(7\,\upmu \hbox {m}\) over the tested angular range. These results were then compared to TCAD simulations carried out using simulations, showing a good agreement for the current-voltage, breakdown and charge collection properties. The simulations have also been used to optimise future sensor design.

Keywords

CLIC Vertex detector HV-CMOS Capacitively coupled pixel detectors Testbeam Simulation TCAD 

References

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Copyright information

© Springer Nature Singapore Pte Ltd.  2018

Authors and Affiliations

  • M. Buckland
    • 1
    • 2
  • on behalf of the CLICdp collaboration
  1. 1.University of LiverpoolLiverpoolUK
  2. 2.CERNGenevaSwitzerland

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