The research on the lead-free solder materials has been a hot topic in electronic packaging industry. Among the lead-free solder materials, Sn–Ag–Cu alloys is potential substitutes for conventional Sn–37Pb solder. The alloys have advantages of good wetting property, superior interfacial properties and high creep resistance. In this article, the organization and welding performance of Sn–Ag–Cu Material were investigated. The experimental results showed that the microstructure of Sn–Cu solder contained a large number of Cu6Sn5 phase, while the main phase in Sn–Ag–Cu alloys was Ag3Sn intermetallic compound which was floc and β-Sn primary crystals, but no Cu6Sn5 phase existed.
H. Naoyuki, U. Tokuteru, T. Yorinobu, Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys original research article. J. Alloys Compd. 527, 226–232 (2012)CrossRefGoogle Scholar
K. Nogita, J. Read, T. Nishimura, Microstructure control in Sn-0.7mass%Cu alloys. Mater. Trans. 46, 2419–2425 (2005)CrossRefGoogle Scholar
K. Fakpan, Y. Otsuka, Y. Mutoh, Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures. J. Proc. Eng. 10, 1238–1243 (2011)CrossRefGoogle Scholar
H. Nishikawa, J.Y. Piao, T. Takemoto, Microstructure of interface between Sn–Cu solder with Ni and Cu plate. J. JPN. I. MET. 70, 427–433 (2011)CrossRefGoogle Scholar
H. Nishikawa, J.Y. Piao, T. Takemoto, Interfacial reaction between Sn-0.7Cu solder and Cu substrate. J. Electron. Mater. 35, 1127–1132 (2006)CrossRefGoogle Scholar
D. Ma, W.D. Wang, S.K. Lahiri, Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow. Appl. Phys. 91, 3312–3317 (2012)CrossRefGoogle Scholar
F. Ochoa, X. Deng, N. Chawla, Effects of cooling rate on creep behavior of a Sn-3.5 Ag alloy. J. Electron. Mater. 33, 1592–1607 (2004)CrossRefGoogle Scholar