Interfacial Diffusion Behavior of Thermal Bimetal 5J20110 with High Sensitivity

  • Donghui Xie
  • Jing Zhang
  • Zhi Qin
  • Min Yu
  • Weifeng Peng
Conference paper

Abstract

The thermal bimetal 5J20110 with high sensitivity was prepared by cold rolling bonding process, the effect of diffusion annealing temperature and time on the properties and interfacial diffusion behavior of 5J20110 was studied. Combining with the principle of diffusion, the diffusion law of interfacial alloy elements was calculated and analyzed, and the relation that the interfacial diffusion layer thickness varying with diffusion annealing temperature and time was deduced. The results showed that the diffusion trend of alloy elements enhanced gradually and the thickness of diffusion layer increased gradually with the increase of diffusion annealing temperature and time, and the bonding strength and resistivity of the thermal bimetal varied little. It is found that the interfacial diffusion layer is solid solution, and the diffusion layer thickness is proportional to the square root of diffusion time t1/2 and e−1/T of diffusion temperature T. The formula for the growth of the interfacial diffusion layer thickness derived in this paper can provide the basis for optimizing the diffusion annealing process.

Keywords

Thermal bimetal Diffusion annealing Interfacial diffusion layer 

References

  1. 1.
    C.Q. Yu, L. Yi, Y.H. Xu, etc, Research on temperature control bimetal with high precision and its manufacturing technology, Elec. Mater 2 (2013) 44–48.Google Scholar
  2. 2.
    Z.H. Xu, Advanced technologies and development trend of thermostat metals, Elec. Mater. 2 (2009) 35–46.Google Scholar
  3. 3.
    Z.W. Huo, R.Y. Liu, J.J. Zhu, Effect of heat treatment process on resistivity thermostat metals, Elec. Mater. 3 (2001) 22–25.Google Scholar
  4. 4.
    T.M. Wang, F. Cao, Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography, J. Alloy. Compd 616 (2014) 550–555.Google Scholar
  5. 5.
    K. Yu, J.M. Song, F.W. Chen, etc. Effect of annealing on interfacial compound and property of Ni–Al composite strip. J. Cent. South. Univ. T 42 (2011) 2297–2302.Google Scholar
  6. 6.
    M. Li, Y.T. Ning, X. Hu, etc. Interface structure and interface diffusion of Pd/Ni and Pd(Y)/Ni composite wires, Prec. Met 23 (2002) 21–25.Google Scholar
  7. 7.
    H.J. Yang, Z.F. Wang, G.S. Jiang, etc, Preparation of Kovar/Cu/Kovar laminates by rolling combination, Rare. Met. Cem. Carb 32 (2008) 7–10.Google Scholar
  8. 8.
    L. Li, K. Nagai, F.X. Yin, Progress in cold bonding of metals. Sci. Technol. Adv. Mater 9 (2008) 1–11.Google Scholar
  9. 9.
    J.S. Pan, J.M. Tong, M.B. Tian, Diffusion in solids, in: Foundation of Materials Science, first ed, Tsinghua University Press, Beijing 2011 pp. 441–484.Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  • Donghui Xie
    • 1
  • Jing Zhang
    • 1
  • Zhi Qin
    • 1
  • Min Yu
    • 1
  • Weifeng Peng
    • 1
  1. 1.Beijing Beiye Functional Materials CorporationQinghe, Haidian District, BeijingChina

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