Diffusion Bonding Properties of Large Dimension WTi Alloy Target Bonded to the Back Plate

  • Zhaochong Ding
  • Haiyang Yu
  • Xiaoyong Wan
  • Ming Chen
  • Yongming Wang
  • Jifeng Lei
Conference paper

Abstract

In this paper, large dimension WTi alloy target for 12 in. wafers was respectively diffusion bonded to Al alloy, Cu alloy or Mo back plate. Then the properties test of the overall deformation after bonding, interface microstructure, bonding rate, tensile strength were conducted. The results showed that after the large dimension WTi alloy target bonded to the Al alloy or Cu alloy back plate, the overall deformation was large, the target was easily crack or debonding, so the reliability was poor. After the WTi alloy target bonded to the Mo back plate, the overall deformation was small, the bonding rate could reach more than 99%, and the tensile strength could be more than 50 MPa which was better than the traditional solder bonding strength (<5 MPa) and could meet the high power sputtering.

Keywords

Sputtering target WTi alloy Diffusion bonding Back plate 

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Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  • Zhaochong Ding
    • 1
    • 2
  • Haiyang Yu
    • 1
    • 2
  • Xiaoyong Wan
    • 1
    • 2
  • Ming Chen
    • 1
    • 2
  • Yongming Wang
    • 1
    • 2
  • Jifeng Lei
    • 1
    • 2
  1. 1.Grikin Advanced Materials Co., Ltd.BeijingChina
  2. 2.Beijing Technology Research Center for Sputtering Target Material Engineering of High Pure MetalsBeijingChina

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