FOWLP: Chip-Last or RDL-First

Chapter

Abstract

Since 2006, NEC Electronics Corporation (now Renesas Electronics Corporation) has been developing a novel SMAFTI (SMArt chip connection with feedthrough interposer) packaging technology for inter-chip wideband data transfer, 3D stacked memory integrated on logic devices, system in wafer-level package (SiWLP), and “RDL-first” fan-out wafer-level packaging. In this chapter, three RDL (redistribution layer) fabrication methods for chip-last FOWLP (fan-out wafer-level packaging) are briefly mentioned.

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Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  1. 1.ASM Pacific TechnologyHong KongHong Kong

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