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Toughening Investigation of Mode III Crack by Holographic Interference Technique

  • Sun Qing-Ping
  • Huang Yong
  • Lin Shu-Tian
  • Si Wen-Jie
Chapter

Abstract

The transformation toughening effect in mode III crack of Ce-TZP ceramics and the crack growth process of the specimen are investigated by the holographic interference technique. The crack growth path under applied loading and the corresponding displacement field of the specimen were clearly recorded by the holographic interferometer. The experimental results showed that there is an obvious stable crack growth stage before final failure and there is obvious toughening effect (R-curve effect) for mode III crack. It is also shown that the crack does not grow along the original crack plane, but deflects with an angle of about 60 °.

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References

  1. 1.
    Evans, A.G., Perspective on the Development of High-Toughness Ceramics. J. Am. Ceram. Soc., 1990, 76, 187–206.CrossRefGoogle Scholar
  2. 2.
    Sun, Q.P., Huang, Y., Yu, S.W. and Hwang, K.C., Toughening Analysis of Mode III Crack in Transformation Toughened Ceramics. to appear in Acta Mechanica Solida Sinica, 1991.Google Scholar

Copyright information

© Elsevier Science Publishers Ltd and MPA Stuttgart 1992

Authors and Affiliations

  • Sun Qing-Ping
    • 1
  • Huang Yong
    • 1
  • Lin Shu-Tian
    • 2
  • Si Wen-Jie
    • 1
  1. 1.Department of Materials Science and EngineeringTsinghua UniversityBeijingP. R. China
  2. 2.Department of Engineering MechanicsTsinghua UniversityBeijingP. R. China

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