Joining of Silicon Nitride Ceramics
The joining of silicon nitride ceramics can be promoted by the presence of reactive elements in brazes or diffusion bonding interlayers. This paper draws attention to the role of Cr and Ti in forming bridging compounds at ceramic-metal interfaces when Ag, Cu or Ni based brazes or Ni diffusion bonding interlayers are used. Laboratory trials showed that bond quality was affected by the concentration of Cr or Ti in brazes, by coating the ceramics with Cr or Ti, and by process variables such as temperature, environment and surface finish.
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