Die-Attach Materials for Extreme Conditions and Harsh Environments

  • Z. Shen
  • O. FaniniEmail author


Various industries drive the requirements for microelectronics and sensor packaging solutions development. A variety of challenging operating environment scenarios can be found in the following industries: oil and gas, aviation, geothermal drilling and subsurface monitoring, automotive, electrical power systems, combustion engine, nuclear power plant, foundries, glass plants, aluminum and steel mills, cement plant kiln, and aerospace. For all phases of packaging technology development, adopted solutions must remain economical and provide the required manufacturability, durability, and reliability that survive a diverse selection of mission profile scenarios.

In recent years, the energy sector has experienced dynamic growth in the development and global deployment of more advanced and complex oil and gas recovery methods in new production areas. Applications of these methods can result in very long service periods, spanning 5–20 years of operation and in harsh environments, with equipment exposed to challenging environmental conditions with high temperature, shock, and vibration. For downhole reservoir well construction and production equipment, it is paramount to maximize efficiencies and safety throughout the lifetime and economic lifecycle of oil and gas reservoirs. Downhole operating well temperatures are gradually increasing past 175 °C, requiring equipment operational capability for temperatures of 200 °C and above. Equipment must be rugged, robust, resilient, reliable, durable, and increasingly miniaturized. The area of power electronics and mechatronics is a critical part of the downhole equipment tools and geothermal and aerospace exploration equipment. Die-attach materials and technology are essential components for microelectronic packaging manufacturing success in harsh environments.

Die-attach materials and technology were developed and evaluated with reliability and durability tests for high-temperature electronics use in 200 °C, 300 °C, and 500 °C applications. Types of solders for high-temperature applications were evaluated, including transient liquid-phase bonding for extreme environments. The most commonly used materials were also compared. Polymer-based attachment materials were reviewed in the categories of conductive adhesive, non-conductive adhesive, cyanate ester, and Ag-glass material. Further system integration using more compact and miniaturized microelectronic equipment modules requires research and development in novel 3D packaging methods and technologies. Challenges in the 3D packaging frontier are briefly mentioned at the end of the chapter.


  1. 1.
    R. Norman, First High Temperature Electronics Products Survey 2005. Sandia National Laboratories, SAND2006-1580, April 2006Google Scholar
  2. 2.
    K. Suganuma, S.-J. Kim, K.-S. Kim, High-temperature lead-free solders: properties and possibilities. J. Miner. Met. Mater. Soc. 61(1), 64–71 (2009)CrossRefGoogle Scholar
  3. 3.
    V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. IEEE Trans. Compon. Packag. Manuf. Technol. 1(4), 457–478 (2011)CrossRefGoogle Scholar
  4. 4.
    P. Zheng, A. Wiggins, R. Johnson, R. Frampton, S. Adam, L. Peltz, Die attach for high temperature electronics packaging, in International Conference and Exhibition on High Temperature Electronics 2008, HiTEC, 2008Google Scholar
  5. 5.
    G. Zeng, S. McDonald, K. Nogita, Development of high temperature solders: review. Microelectron. Reliab. 52, 1306–1322 (2012)CrossRefGoogle Scholar
  6. 6.
    I. Anderson, S. Choquette, Pb-free solders and other joining materials for potential replacement of high-Pb hierarchical solders, in Pan Pacific Microelectronics Symposium (Pan Pacific), 2018, Waimea, HI, 5–8 Feb. 2018Google Scholar
  7. 7.
    W. Sabbah, S. Azzopardi, C. Buttay, R. Meuret, E. Woirgard, Study of die attach technologies for high temperature power electronics: silver sintering and gold–germanium alloy. Microelectron. Reliab. 53, 1617–1621 (2013)CrossRefGoogle Scholar
  8. 8.
    V. Chidambaram, J. Hattel, J. Hald, High-temperature lead-free solder alternatives. Microelectron. Eng. 88(6), 981–989 (2011)CrossRefGoogle Scholar
  9. 9.
    J.G. Bai, Z. Zhang, J.N. Calata, T. Lei, G. Lu, Low-temperature sintering of nanoscale silver paste: a lead-free die-attach solution for high-performance and high-temperature electronic packaging, in International Conference on High Temperature Electronics (HiTEC 2006), Santa Fe, NM, 15–18 May 2006Google Scholar
  10. 10.
    C. Hunt, L. Crocker, O. Thomas, M. Wickham, K. Clayton, L. Zou, R. Ashayer-Soltani, A. Longford, High Temperatures Solder Replacement to Meet RoHS (National Physical Laboratory, Middlesex, UK, NPL REPORT MAT 64, 2014)Google Scholar
  11. 11.
    Z. Shen, R. Wayne Johnson, E. Snipes, Lead free solder attach for 200°C applications, in International conference on High Temperature Electronics (HiTEN 2013), Oxford, UK, 8–10 July 2013Google Scholar
  12. 12.
    L.C. Wai, S.W. Wei, H.H. Yuan, D.R. MinWoo, High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (−65 to +150DegC) applications, in IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, pp. 229–234Google Scholar
  13. 13.
    S. Egelkraut, L. Frey, M. Knoerr, A. Schletz, Evolution of shear strength and microstructure of die bonding technologies for high temperature applications during thermal aging, in 12th Electronics Packaging Technology Conference, 2010, pp. 660–667Google Scholar
  14. 14.
    Z. Shen, A. Reiderman, High-temperature reliability of wire bonds on thick film, in International Microelectronics assembly and Package Symposium 2017, Raleigh, NC, Oct. 2017Google Scholar
  15. 15.
    Z. Shen, K. Fang, R. Wayne Johnson, M.C. Hamilton, Characterization of Bi–Ag–X solder for high temperature SiC die attach. IEEE Trans. Compon. Packag. Manuf. Technol. 4(11), 1778–1784 (2014)CrossRefGoogle Scholar
  16. 16.
    D.J. Hayes, W. Royall Cox, M.E. Grove, Micro-jet printing of polymers and solder for electronics manufacturing. J. Electron. Manuf. 8(3 & 4), 209–216 (1998)CrossRefGoogle Scholar
  17. 17.
    J. Ciulik, M.R. Notis, The Au Sn phase diagram. J. Alloys Compd. 191(1), 71–78 (1993). (figure 8)CrossRefGoogle Scholar
  18. 18.
    D. Hamilton, L. Mills, S. Riches, P. Mawby, Performance and reliability of SiC dies, die attach and substrates for high temperature power applications up to 300°C, in International Conference and Exhibition on High Temperature Electronics Network (HiTEN), Cambridge, UK, 6–8 July 2015Google Scholar
  19. 19.
    R. Ping Hagler, W. Johnson, L.-Y. Chen, SiC die attach metallurgy and processes for applications up to 500°C. IEEE Trans. Compon. Packag. Manuf. Technol. 1(4), 630–639 (2011)CrossRefGoogle Scholar
  20. 20.
    K. Gurth et al., New assembly and interconnects beyond sintering methods, in International Exhibition & Conference for Power Electronics, Intelligent Motion, Renewable Energy & Energy Market, 2010, PCIM, pp. 232–237Google Scholar
  21. 21.
    M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, A. Sharif, The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering Surf. Mount Technol. 17(2), 40–48 (2005)CrossRefGoogle Scholar
  22. 22.
    L.J. Matienzo, R.N. Das, F.D. Egitto, Electrically conductive adhesives for electronic packaging and assembly applications. J. Adhes. Sci. Technol. 22, 853–869 (2008)CrossRefGoogle Scholar
  23. 23.
    D. Farley, A. Dasgupta, J.F.J.M. Caers, Characterization of non-conductive adhesives, in Proceedings of ASME Inter PACK 2005, San Francisco, CA, 17–22 July 2005Google Scholar
  24. 24.
    J.N. Hay, Chapter 6, in Chemistry and Technology of Cyanate Ester Resins, ed. by I. Hamerton (Blackie, New York, 1994), pp. 151–192, (CE1–12) and Appendices A.3 – A.8 (pp. 332–341)Google Scholar
  25. 25.
    I. Hamerton, High-performance thermoset-thermoset polymer blends: a review of the chemistry of cyanate ester bismaleimide blends. High Perform. Polym. 8(1), 83–95 (1996)CrossRefGoogle Scholar
  26. 26.
    D. Herr, N.A. Nikolic, R.A. Schultz, Chemistries for high reliability in electronics assemblies. High Perform. Polym. 13, 79–100 (2001)CrossRefGoogle Scholar
  27. 27.
    R. Kisiel, Z. Szczepański, Die-attachment solutions for SiC power devices. Microelectron. Reliab. 49, 627–629 (2009)CrossRefGoogle Scholar
  28. 28.
    T. Hongsmatip, B. Twombly, Dynamic mechanical analysis of silver/glass die attach material, in 1995 Proceedings of the 1995 45th IEEE Electronic Components & Technology Conference, 21–24 May 1995, pp. 692–700Google Scholar
  29. 29.
    R. Zeiser, L. Lehman, V. Fiedler, J. Wilde, Reliability of flip-chip technologies for SiC-MEMS operating at 500°C, in 2013 Electronic Components & Technology Conference, ECTC 2013, 28–31 May 2013Google Scholar
  30. 30.
    C.T. Tan, K. Naoya, Y.S. Lee, K. Tan, Breakthrough development of new die attach method with high conductive wafer back coating, in 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–5Google Scholar
  31. 31.
    M. Lindgren, I. Belov, P. Leisner, Experimental evaluation of glob-top materials for use in harsh environments. Int. Microelectron. Packag. Soc. 2(4, 4th Qtr), 253 (2005)CrossRefGoogle Scholar
  32. 32.
    H.T. Wang, Y.C. Poh, An analysis on the properties of epoxy based die attach material and the effect to delamination and wire bondability, in 33rd International Electronics Manufacturing Technology Conference, 2008, pp. 1–6Google Scholar
  33. 33.
    Y.-W. Huang, C.-W. Fan, Y.-M. Lin, S.-Y. Fun, S.-C. Chung, J.-Y. Juang, R.-S. Cheng, S.-Y. Huang, Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30μm-pitch micro interconnections, in 2015 Electronic Components & Technology Conference, 2015, pp. 490–495Google Scholar
  34. 34.
    D. D’Angelo, S. Manian Ramkumar, P. Borgesen, Evaluation of a novel anisotropic conductive adhesive shear under multiple tin-lead and lead free reflow cycles for package-on package (POP) assembly, in Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition IMECE 2012, Houston, TX, 9–15 Nov. 2012, pp. 1–9Google Scholar

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© Springer Nature Switzerland AG 2019

Authors and Affiliations

  1. 1.Baker Hughes & GE CompanyHoustonUSA

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