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Thermal Control of Stress in Photoresist Film for Improving Selectivity in Electro-Plating Process

  • Niraj KumarEmail author
  • Rajesh Kumar Jat
  • Prateek Kumar
  • Hemant Kumar Saini
  • Sneh Lata
  • Rupesh Kumar Chaubey
  • Robert Laishram
  • Vanita R. Agarwal
  • D. S. Rawal
Conference paper
Part of the Springer Proceedings in Physics book series (SPPHY, volume 215)

Abstract

In this work, we report the effect of stress generated in a photo-resist film during micro lithography sequence and its impact on selective electro plating process. Series of experiments were carried out to find an optimum pre-bake temperature which resulted in more control over stress generated in the photo-resist film and hence seepage free smooth plating process.

References

  1. 1.
    Fujifilm, Technical Product informationGoogle Scholar
  2. 2.
    Gold Bulletin 2007. 40/2Google Scholar

Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Niraj Kumar
    • 1
    Email author
  • Rajesh Kumar Jat
    • 1
  • Prateek Kumar
    • 1
  • Hemant Kumar Saini
    • 1
  • Sneh Lata
    • 1
  • Rupesh Kumar Chaubey
    • 1
  • Robert Laishram
    • 1
  • Vanita R. Agarwal
    • 1
  • D. S. Rawal
    • 1
  1. 1.Solid State Physics LaboratoryTimarpur New DelhiIndia

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