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Study on the Conventional Versus Photonic (IPL) Sintering of Copper Nanoparticle (Cu NPs) Inks on Different Flexible Substrates

  • Svetlana P. JoseEmail author
  • Piyush Kumar
  • Chinmay Bapat
  • Ashish Gupta
  • Juliane Tripathi
  • Monica Katiyar
  • Y. N. Mohapatra
Conference paper
Part of the Springer Proceedings in Physics book series (SPPHY, volume 215)

Abstract

In General, flexible substrates can only with stand a very low temperature. High processing time on conventional sintering methods can deteriorate the substrate. Photonic sintering uses intense pulsed light with a broad spectrum in the visible range to sinter metal precursor inks in a selective manner (Perelaer and Schuber in Mater Res Soc 28:564–573, 2013 [1]). Intense Pulsed light sintering is the process of sintering conductive inks and thin films in milliseconds (processing time) without heating the underlying substrate. Inexpensive substrates can be thermally processed without extending the processing time. According to the end use, the conductivity values are optimized. Since this process cures thin films at high temperature on low temperature substrate it is a good option for polymers, papers and glass substrates (substrate variability). Improved conductive performance is achieved through this process.

References

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Svetlana P. Jose
    • 1
    Email author
  • Piyush Kumar
    • 1
  • Chinmay Bapat
    • 1
  • Ashish Gupta
    • 1
  • Juliane Tripathi
    • 1
  • Monica Katiyar
    • 1
    • 2
  • Y. N. Mohapatra
    • 1
    • 3
  1. 1.National Centre for Flexible ElectronicsKanpurIndia
  2. 2.Materials Science and Engineering DepartmentIndian Institute of TechnologyKanpurIndia
  3. 3.Department of PhysicsIndian Institute of TechnologyKanpurIndia

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