The Effect of Chamber Temperature on Residual Stresses of FDM Parts

  • C. Casavola
  • A. Cazzato
  • D. Karalekas
  • V. MoramarcoEmail author
  • G. Pappalettera
Conference paper
Part of the Conference Proceedings of the Society for Experimental Mechanics Series book series (CPSEMS)


The Fused Deposition Modelling (FDM) is nowadays one of the most widespread and employed processes to build complex 3D prototypes directly from a STL model. In this technique, the part is built as a layer-by-layer deposition of a feedstock wire. This typology of deposition has many advantages but it produces rapid heating and cooling cycles of the feedstock material that introduces residual stresses in the part during the building-up. Consequently, warping, de-layering and distortion of the part during the print process are common issues in FDM parts and are related to residual stresses. In the view to reduce this kind of issues, the high-level print systems use a heated chamber. The aim of the present work is to measure the residual stresses in several points of the printed parts, both on top and bottom, in order to verify if the use of the heated chamber during the printing produce substantial variation. The residual stresses have been measured in ABS parts employing the hole-drilling method. In order to avoid the local reinforcement of the strain gage, an optical technique, i.e. ESPI (electronic speckle pattern interferometry), is employed to measure the displacement of the surface due to the stress relaxation and, consequently, to calculate the residual stresses.


3D printing Residual stress Fused deposition modelling Hole drilling ESPI 


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Copyright information

© The Society for Experimental Mechanics, Inc. 2019

Authors and Affiliations

  • C. Casavola
    • 1
  • A. Cazzato
    • 1
  • D. Karalekas
    • 2
  • V. Moramarco
    • 1
    Email author
  • G. Pappalettera
    • 1
  1. 1.Dipartimento di MeccanicaMatematica e Management (DMMM) – Politecnico di BariBariItaly
  2. 2.Laboratory of Advanced Manufacturing Technologies and TestingUniversity of PiraeusPiraeusGreece

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