Bits on Chips pp 233-250 | Cite as


  • Harry Veendrick


The development of the IC package is a dynamic technology. Applications that were unattainable only a decade ago are now commonplace thanks to advances in package design. Moreover, the increasing demand for smaller, faster and cheaper products is forcing the packaging technology to keep pace with the progress in semiconductor technology.


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Copyright information

© Springer International Publishing AG, part of Springer Nature 2019

Authors and Affiliations

  • Harry Veendrick
    • 1
  1. 1.HeezeThe Netherlands

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