Bits on Chips pp 203-220 | Cite as

Testing and Yield

  • Harry Veendrick


An integrated circuit can fall victim to a large variety of failure mechanisms. Ideally, the related problems are detected early in the manufacturing process. However, some only show up during the final tests, or even worse, they might not be identified before the chip is soldered on a customer’s board.


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Copyright information

© Springer International Publishing AG, part of Springer Nature 2019

Authors and Affiliations

  • Harry Veendrick
    • 1
  1. 1.HeezeThe Netherlands

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