A Multiple Compatible Compression Scheme Based on Tri-state Signal

  • Tian ChenEmail author
  • Yongsheng Zuo
  • Xin An
  • Fuji Ren
Conference paper
Part of the Studies in Distributed Intelligence book series (SDI)


A novel test data compression scheme based on the tri-state signal is proposed to solve the problem of increasing embedded chip test data in the development of Smart City. Firstly, partial inputs reduction is performed on the test set, and the don’t care bits proportion is improved by merging the test patterns with a high bit ratio so that the compatibility of each test pattern is improved. After using the inputs reduction technology, using the characteristics of the tri-state signal, the test set is divided into several sub-segments and uses the tri-state signal to compress the sub-segments with compatible coding, and the compression rate of the test set is improved by considering multiple compatible rules. The experimental results show that compared with the previous work results, the proposed scheme achieves a good compression ratio, the average test compression ratio can reach 82.15%. At the same time, the test power and area overhead are not significantly improved.


Compression Automatic test equipment Circuit 



This work sponsored by: The Key Program of the National Natural Science Foundation of China (Grant No. 61432004); The National Natural Science Foundation of China (Grant No.61474035, No.61204046, No.61502140); NSFC-Shenzhen Joint Foundation (Key Project) (Grant No.U1613217).


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Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Tian Chen
    • 1
    • 2
    Email author
  • Yongsheng Zuo
    • 1
    • 2
  • Xin An
    • 1
    • 2
  • Fuji Ren
    • 2
    • 3
    • 4
  1. 1.School of Computer and InformationHefei University of TechnologyHefeiChina
  2. 2.Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent MachineHefei University of TechnologyHefeiChina
  3. 3.School of Computer Science and Information EngineeringHefei University of TechnologyHefeiChina
  4. 4.Faculty of EngineeringThe University of TokushimaTokushimaJapan

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