Fabrication of Polymeric Micro Structures Using Improved Hot Embossing Technique

  • Pham Hong PhucEmail author
  • Dao Viet Dzung
Conference paper
Part of the Lecture Notes in Networks and Systems book series (LNNS, volume 104)


The paper proposes an improved hot embossing process of polymeric PMMA material using low-friction silicon molds, forcing and water-cooling subsystems integrated additionally, aiming to reduce total time of embossing cycle and extend lifetime of a master mold. The result of embossing experiments shows that the profile of PMMA micro structures (with a minimum feature size of 2 µm) using improved embossing process is sharper, higher aspect ratio and more uniformed than the counterparts, which use the traditional process without vacuum.


Polymeric PMMA Hot embossing Silicon mold DRIE process 



This research is funded by Vietnam National Foundation for Science and Technology Development (NAFOSTED) under Grant number ‘‘107.01-2019.05’’.


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© Springer Nature Switzerland AG 2020

Authors and Affiliations

  1. 1.School of Mechanical EngineeringHanoi University of Science and Technology (HUST)HanoiVietnam
  2. 2.Griffith UniversityGold CoastAustralia

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