Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts
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Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.
KeywordsDiffusion bonding Sintering Electrical contacts EDS
This work was partly funded by the Powder Metal Initiative (PMI) through the Pennsylvania Department of Community and Economic Development (DCED), grant #C000063072, and by the Engineering Technology and Commonwealth Engineering (ETCE), Pennsylvania State University. Conventional sintering by Symmco Inc. and Contact Technologies Inc. is also gratefully acknowledged.
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