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Methodology and Best-Practice Guidelines for Thermally Optimized Driver Design

  • Renaud GillonEmail author
  • Aarnout Wieers
  • Frederik Deleu
  • Rick Janssen
  • Wim Schoenmaker
  • Bart De Smedt
  • Hervé Guegnaud
  • Pascal Reynier
Chapter
Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 29)

Abstract

An important outcome of the validation activities is the formulation of methodologies to address coupled problems in EDA. This chapter describes typical coupled problems arising in the field of activities of the industrial partners. It also highlights the challenges and makes the link to some test cases. In order to address these challenges and solve the design problems illustrated by the test cases, several design flows were put in place based on outcomes of the project activities. We describes these flows as well as the tools set-up in order to support them. Finally, the recommended usage of these flows is proposed.

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Renaud Gillon
    • 1
    Email author
  • Aarnout Wieers
    • 1
  • Frederik Deleu
    • 1
  • Rick Janssen
    • 2
  • Wim Schoenmaker
    • 3
  • Bart De Smedt
    • 3
  • Hervé Guegnaud
    • 4
  • Pascal Reynier
    • 4
  1. 1.ON Semiconductor Belgium BVBAOudenaardeBelgium
  2. 2.NXP SemiconductorsEindhoventhe Netherlands
  3. 3.MAGWEL NVLeuvenBelgium
  4. 4.ACCO SemiconductorLouveciennesFrance

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