Ageing Models and Reliability Prediction
We overview reliability related activities like ageing and life time prediction. We want to predict the number of thermal stress cycles an IC can handle before showing passivation cracks. For this a sufficient model for electro-migration was used that can be applied to an IC with multiple drivers and knowing a required thermal profile. At first state-of-the-art reliability concepts are reviewed. Next a new framework is introduced that aims at simplifying and speeding-up the process of assessing the reliability of complex application profiles.
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