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Ageing Models and Reliability Prediction

  • Renaud GillonEmail author
  • Aarnout Wieers
  • Frederik Deleu
  • Tomas Gotthans
  • Rick Janssen
  • Wim Schoenmaker
  • E. Jan W. ter Maten
Chapter
Part of the Mathematics in Industry book series (MATHINDUSTRY, volume 29)

Abstract

We overview reliability related activities like ageing and life time prediction. We want to predict the number of thermal stress cycles an IC can handle before showing passivation cracks. For this a sufficient model for electro-migration was used that can be applied to an IC with multiple drivers and knowing a required thermal profile. At first state-of-the-art reliability concepts are reviewed. Next a new framework is introduced that aims at simplifying and speeding-up the process of assessing the reliability of complex application profiles.

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Copyright information

© Springer Nature Switzerland AG 2019

Authors and Affiliations

  • Renaud Gillon
    • 1
    Email author
  • Aarnout Wieers
    • 1
  • Frederik Deleu
    • 1
  • Tomas Gotthans
    • 2
  • Rick Janssen
    • 3
  • Wim Schoenmaker
    • 4
  • E. Jan W. ter Maten
    • 5
  1. 1.ON Semiconductor Belgium BVBAOudenaardeBelgium
  2. 2.Brno University of TechnologyBrnoCzech Republic
  3. 3.NXP SemiconductorsEindhoventhe Netherlands
  4. 4.MAGWEL NVLeuvenBelgium
  5. 5.Bergische Universität WuppertalWuppertalGermany

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