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SOC Packaging

  • Veena S. Chakravarthi
Chapter

Abstract

This chapter deals with packaging of SOC, package architectures, package options available, selection criteria for SOC packages, and package performance.

Keywords

Packaging Plastic package LQFP QFN BGA Ceramic package MIL Commercial Space Industry standard Flip-chip package Bondability Wire bonding 

Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Veena S. Chakravarthi
    • 1
  1. 1.Sensesemi Technologies Private LimitedBangaloreIndia

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