“Thermal Analysis of Micro Channel Heat Sink with Various Shapes of Dimples”

  • V. A. Jagadale
  • S. M. Sarange
  • S. V. Jadhav
  • A. G. Kamble
Conference paper


The power density of electronic devices is increasing with technology development. The cooling of electronic systems is essential for controlling the temperature of componenet and avoiding any hot spot. The various micro-devices are now extensively employed in electronic application especially for cooling the integrated circuits (IC, microchip, silicon chip, computer chip, etc.). Micro-channel heat sinks are used in electronics cooling together with different technologies to enhance its heat transfer performance. Because of above, the heat transfer enhancement and pressure drop reduction with four different shaped dimples (Circular shaped, Square shaped, Almond, shaped and oval or Elliptical shaped) in the microchannel, were designed and studied numerically and experimentally under the condition of laminar flow. The results show that use of dimples in the microchannel can enhance heat transfer and decrease flow resistance under the condition of laminar flow. Compared with microchannel heat sink without dimples, the dimpled-microchannel heat sink has a better cooling capacity and can be an attractive choice for cooling of future microelectronics.


Convective heat transfer Heat transfer coefficient Micro channels Nusselt’s number Reynolds number 



Area (m2)


Specific Heat, (kJ/kgK)


Hydraulic Diameter, (m)


Heat Transfer Coefficient, (kW/m2 K)


Thermal Conductivity, (W/mK)


Mass Flow Rate, (kg/s)


Nusselts Number


Pressure Drop, (kPa)


Prandtl Number


Wet Perimeter, (m)


Heat Transfer Rate, (W)


Reynolds Number


Temperature, (°C)


Velocity, (m/s)


Density, (kg/m3)











  1. 1.
    Tuckerman DB, Pease RFW (1981) High-performance heat sinking for VLSI. IEEE Electron Device Lett 2:126–129CrossRefGoogle Scholar
  2. 2.
    Cheng YJ (2007) Numerical simulation of the stacked microchannel heat sink with mixing-enhanced passive structure. Int Commun Heat Mass Trans 34:295–303CrossRefGoogle Scholar
  3. 3.
    Mohammed HA, Gunnasegaran P, Shuaib NH (2011) Influence of channel shape on thethermal and hydraulic performance of microchannel heat sink. Int Commun Heat Mass Trans 38:474–480CrossRefGoogle Scholar
  4. 4.
    Lu H, Gong L (2013) Thermal performance of microchannels with dimples for electronics cooling, ASME 2013 4th micro/nanoscale heat & mass transfer international conference, (2013), Hong Kong SAR, ChinaGoogle Scholar
  5. 5.
    Qu H, Shen Z, Xie Y Numerical investigation of flow and heat transfer in a dimpled channel among transitional Reynolds Numbers”, Vol. 2013, Article.ID 989237Google Scholar
  6. 6.
    Pooja Patil1, Prof.Padmakar Deshmukh: An experimental study of heat transfer enhancementin the circular channel with almond shape dimples, e-ISSN: 2278-1684, p- ISSN: 2320-334X, Vol. 11, Issue 5 Ver. I (2014), PP 48-57Google Scholar
  7. 7.
    Ahmed J, Sardar HR, Kaladgi AR (2015) Forced convection heat transfer analysis of square-shaped dimples on flat plates. Am J Energy Eng 3(5):66. CrossRefGoogle Scholar
  8. 8.
    Akthar F, Razak R Kaladgi A, Samee M (2015) Heat transferaugmentation using dimples in forced convection an experimental approach. IJMERR 4(1)Google Scholar
  9. 9.
    Wangikar SS, Potwari P, Misra R d (2017) Numerical and experimental investigations on the performance of a serpentine microchannel with semicircular obstacles. Microsyst Technol:–5977–5988Google Scholar
  10. 10.
    Das SS, Tilekar SD, Wangikar SS, Patowari PK (2017) Numerical and experimental study of passive fluids mixing in microchannels of different configurations. Microsyst Technol 23:5977–5988CrossRefGoogle Scholar
  11. 11.
    Das SS, Patowari PK (2018) Fabrication of serpentine micro-channels on the glass by ultrasonic machining using developed micro-tool by wire-cut electric discharge machining. Int J Adv Manuf Technol 95(5–8):3013–3028CrossRefGoogle Scholar
  12. 12.
    Gidde RR, Pawar PM, Ronge BP, Shinde AB, Misal ND, Wangikar SS (2018) Flow field analysis of a passive wavy micromixer with CSAR and ESAR elements. Microsyst Technol:1–14. CrossRefGoogle Scholar
  13. 13.
    Jadhav SV, Pawar PM, Ronge BP (2018) Analysis of pin-fin geometry effect on microchannel heat sink performance. Int J Mech Prod Eng Res Dev 8(4):653–666Google Scholar
  14. 14.
    Jadhav SV, Pawar PM, Ronge BP Effect of pin-fin geometry on microchannel performance. Chem Prod Process Model.
  15. 15.
    Wangikar SS, Patowari PK, Misra RD (2017) Effect of process parameters and optimization for photochemical machining of brass and german silver. Mater Manuf Process 32(15):1747–1755CrossRefGoogle Scholar
  16. 16.
    Wangikar SS, Patowari PK, Misra RD (2018) Parametric optimization for photochemical machining of copper using overall evaluation criteria. Mater Today Proc 5(2):4736–4742CrossRefGoogle Scholar
  17. 17.
    Wangikar SS, Patowari PK, Misra RD (2016, December) Parametric optimization for photochemical machining of copper using grey relational method. In: Techno-societal 2016, international conference on advanced technologies for societal applications. Springer, Cham, pp 933–943Google Scholar
  18. 18.
    Wangikar SS, Patowari PK, Misra RD, Misal ND (2019) Photochemical machining: a less explored non-conventional machining process. In: Non-conventional machining in modern manufacturing systems. IGI Global, Hershey, pp 188–201CrossRefGoogle Scholar

Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • V. A. Jagadale
    • 1
  • S. M. Sarange
    • 2
  • S. V. Jadhav
    • 3
  • A. G. Kamble
    • 1
  1. 1.D. Y. Patil School of engineeringTalegaonIndia
  2. 2.D. Y. Patil school of engineering and technologyLohangaonIndia
  3. 3.SVERIS college of engineeringPandharpurIndia

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