Performance Analysis of Elliptical Pin Fins in the Microchannels

  • Subhash V. JadhavEmail author
  • Prashant M. Pawar
  • Anil B. Shinde
  • Sandeep S. Wangikar
Conference paper


A numerical analysis was carried out to study the effect of the different pin fin layout in the microchannel heat sink. Three-Dimensional numerical analysis was carried out using the conjugate heat transfer module of COMSOL MULTIPHYSICS software. Initially, a microchannel heat sink with elliptical pin fins of 500 μm fin height was analysed and the results were validated with the results from the literature. Further, four microchannels with different pin fin layouts were investigated in terms of heat transfer coefficient and pressure drop. The analysis was done for the different angle between the major axis of the ellipse of pin fin and fluid flow direction. Then the analysis was done for the different axial distance between pin fins. It was observed from this study, that the variation in axial distance between fin pins is a better way to enhances the thermal performance of a microchannel heat sink compared to the change in the angle between the major axis of the ellipse to the fluid flow direction.


Microchannel heat sink Numerical analysis Heat transfer coefficient Pressure drop Pin fin layout 



Hydraulic diameter of the channel (4Ac/Pc)


Heat transfer coefficient (W/m2 K)


Thermal conductivity (W/m K)


Heat flux (W/m2)


Reynolds number


Fluid bulk temperature (K)


Near wall temperature (K)


Average axial velocity (m/s)


Dynamic viscosity


Density (kg/m3)


  1. 1.
    Tuckerman DB, Pease RFW (1981) High-performance heat sinking for VLSI. IEEE Electron Device Lett 2:126–129CrossRefGoogle Scholar
  2. 2.
    John TJ, Mathew B, Hegab H (2010) Parametric study on the combined thermal and hydraulic performance of single phase micro pin fin heat sinks part I: square and circle geometries. Int J Therm Sci 49:2177–2190CrossRefGoogle Scholar
  3. 3.
    Wangikar SS, Potwari P, Misra RD (2018) Numerical and experimental investigations on the performance of a serpentine microchannel with semicircular obstacles. Microsyst Technol 24:3307–3320CrossRefGoogle Scholar
  4. 4.
    Tullius JF, Tullius TK, Bayazitoglu Y (2012) Optimization of short micro pin fins in minichannels. Int J Heat Mass Transf 55:3921–3932CrossRefGoogle Scholar
  5. 5.
    Chiu HC, Hsieh RH, Jang JH (2013) Numerical analysis of the heat transfer of heat sink with micro-pin fins. ECS Trans 52:759–764CrossRefGoogle Scholar
  6. 6.
    Tomar YS, Sahu MM (2013) Review of performance analysis of extended surfaces (fins) under free and forced convection heat transfer. Int J Innovative Res Dev 2(13):73–78Google Scholar
  7. 7.
    Tzer MJ, Sheng CT (2015) Numerical simulation of laminar forced convection of pin fin heat sink Array in a channel by using porous approach. Appl Sci 5:1846–1868CrossRefGoogle Scholar
  8. 8.
    Dawei Y, Yan W, Guifu D, Zhiyu J et al (2017) Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations. Appl Therm Eng 112:1547–1556CrossRefGoogle Scholar
  9. 9.
    Jadhav SV, Pawar PM, Ronge BP (2018) Analysis of pin-fin geometry effect on microchannel heat sink performance. Int J Mech Prod Eng Res Dev 8(4):653–666Google Scholar
  10. 10.
    Das SS, Tilekar SD, Wangikar SS, Patowari PK (2017) Numerical and experimental study of passive fluids mixing in micro-channels of different configurations. Microsyst Technol 23(12):5977–5988CrossRefGoogle Scholar
  11. 11.
    Wangikar SS, Patowari PK, Misra RD (2017) Effect of process parameters and optimization for photochemical machining of brass and German silver. Mater Manuf Process 32(15):1747–1755CrossRefGoogle Scholar
  12. 12.
    Wangikar SS, Patowari PK, Misra RD (2018) Parametric optimization for photochemical machining of copper using overall evaluation criteria. Mater Today Proc 5(2):4736–4742CrossRefGoogle Scholar
  13. 13.
    Wangikar SS, Patowari PK, Misra RD (2016) Parametric optimization for photochemical machining of copper using grey relational method. In: Techno-societal 2016, international conference on advanced Technologies for Societal Applications, December. Springer, Cham, pp 933–943Google Scholar
  14. 14.
    Wangikar SS, Patowari PK, Misra RD, Misal ND (2019) Photochemical machining: a less explored non-conventional machining process. In: Non-conventional machining in modern manufacturing systems. IGI Global, Hershey, pp 188–201CrossRefGoogle Scholar

Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Subhash V. Jadhav
    • 1
    Email author
  • Prashant M. Pawar
    • 1
  • Anil B. Shinde
    • 1
  • Sandeep S. Wangikar
    • 1
  1. 1.SVERI’s College of EngineeringPandharpurIndia

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